M-Xylene

M-Xylene

SCHEMBL2292576

Cc1cccc(C)c1.Cc1cccc(C)c1.Cc1cccc(C)c1.P

nearest known ligand 0.92

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACHE P22303 6/20 0.92
ALDH1A1 P00352 2/20 0.58
MAPK1 P28482 1/20 0.58
TSHR P16473 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
LMNA P02545 1/20 0.50
ALOX12 P18054 1/20 0.50
TP53 P04637 1/20 0.50
CYP1A2 P05177 2/20 0.48
NPC1 O15118 1/20 0.48
CASP3 P42574 1/20 0.48
SENP8 Q96LD8 1/20 0.48
SENP7 Q9BQF6 1/20 0.48
SENP6 Q9GZR1 1/20 0.48
CYP3A4 P08684 1/20 0.48
CYP2D6 P10635 1/20 0.48
MAPT P10636 1/20 0.48
CYP2C9 P11712 1/20 0.48
CYP2C19 P33261 1/20 0.48
HTT P42858 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
M-Xylene SCHEMBL28126413 1.00
M-Xylene SCHEMBL11598111 0.96 ACHE (0.86) ACHEALDH1A1MAPK1TSHRTDP1
M-Xylene SCHEMBL891494 0.96 ACHE (1.00) ACHEALDH1A1MAPK1TSHRTDP1
M-Xylene SCHEMBL6397624 0.96
M-Xylene SCHEMBL28189 0.96
M-Xylene SCHEMBL78260 0.92 ACHE (0.92) ACHEALDH1A1MAPK1TSHRTDP1
M-Xylene SCHEMBL18045662 0.92
M-Xylene SCHEMBL6838834 0.92
M-Xylene SCHEMBL4596533 0.92 ACHE (0.92) ACHEALDH1A1MAPK1TSHRTDP1
M-Xylene SCHEMBL18890231 0.92 ACHE (0.92) ACHEALDH1A1MAPK1TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2062953-B1 Heat-sensitive adhesive material RICOH CO LTD (JP) 2011-08-17 EP disclosed
US-7993732-B2 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2011-08-09 US disclosed
EP-2062953-A1 Heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2009-05-27 EP disclosed
US-20090130441-A1 HEAT-SENSITIVE ADHESIVE MATERIAL RICOH COMPANY, LTD (JP) 2009-05-21 US disclosed
US-20080026205-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2008-01-31 US disclosed
EP-1882726-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2008-01-30 EP disclosed