SCHEMBL2296841

SCHEMBL2296841

C=COP(=O)(Oc1ccccc1)c1ccccc1

nearest known ligand 0.68

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 2/20 0.68
TDP1 Q9NUW8 1/20 0.68
CA12 O43570 10/20 0.50
CA1 P00915 10/20 0.50
CA2 P00918 10/20 0.50
CA4 P22748 10/20 0.50
CA5A P35218 10/20 0.50
CA7 P43166 10/20 0.50
CA9 Q16790 10/20 0.50
CA5B Q9Y2D0 10/20 0.50
ALOX15 P16050 1/20 0.46
TSHR P16473 1/20 0.46
SRC P12931 1/20 0.44
KDM4E B2RXH2 1/20 0.39
MEN1 O00255 1/20 0.38
LMNA P02545 1/20 0.38
KMT2A Q03164 1/20 0.38
PKM P14618 1/20 0.37
HTT P42858 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL331836 0.86 ALOX15 (0.54) L3MBTL1TDP1CA12CA1CA2
SCHEMBL29007122 0.83 L3MBTL1 (0.70) L3MBTL1TDP1CA12CA1CA2
SCHEMBL561190 0.82 L3MBTL1 (1.00) L3MBTL1TDP1CA12CA1CA2
SCHEMBL2524536 0.79 SRC (0.48) L3MBTL1TDP1ALOX15TSHRSRC
SCHEMBL404369 0.79 SRC (0.48) L3MBTL1TDP1ALOX15TSHRSRC
SCHEMBL8741331 0.77 L3MBTL1 (0.61) L3MBTL1TDP1CA12CA1CA2
SCHEMBL11317012 0.77 L3MBTL1 (0.61) L3MBTL1TDP1CA12CA1CA2
SCHEMBL778687 0.76 TDP1 (0.66) L3MBTL1TDP1CA12CA1CA2
Carbon Monoxide SCHEMBL6562620 0.76 L3MBTL1 (0.87) L3MBTL1TDP1CA12CA1CA2
SCHEMBL4128871 0.76 SRC (0.55) L3MBTL1TDP1ALOX15TSHRSRC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116716072-A Multi-component filler FC-BGA packaging loading plate layer-increasing adhesive film, preparation method and application thereof 深圳市纽菲斯新材料科技有限公司 2023-09-08 CN claimed
CN-117999319-A Halogen-free flame-retardant curable resin composition, prepreg, metal-clad laminate, and printed wiring board 日铁化学材料株式会社 2024-05-07 CN disclosed
CN-116716072-A Multi-component filler FC-BGA packaging loading plate layer-increasing adhesive film, preparation method and application thereof 深圳市纽菲斯新材料科技有限公司 2023-09-08 CN disclosed
WO-2023053782-A1 HALOGEN-FREE FLAME-RETARDANT CURABLE RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD 日鉄ケミカル&マテリアル株式会社 2023-04-06 WO disclosed
US-11346999-B2 Optical fiber cable, harness, and method of manufacturing optical fiber cable MITSUBISHI CHEMICAL CORPORATION (JP) 2022-05-31 US disclosed
EP-3766853-A1 OPTICAL FIBER CABLE, HARNESS, AND METHOD FOR PRODUCING OPTICAL FIBER CABLE Mitsubishi Chemical Corporation (JP) 2021-01-20 EP disclosed
US-20200408987-A1 OPTICAL FIBER CABLE, HARNESS, AND METHOD OF MANUFACTURING OPTICAL FIBER CABLE MITSUBISHI CHEMICAL CORPORATION (JP) 2020-12-31 US disclosed
CN-103259044-B Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery MITSUBISHI CHEMICAL CORP. (JP) 2016-02-10 CN disclosed
CN-102097654-B Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery MITSUBISHI CHEMICAL CORP. (JP) 2014-10-01 CN disclosed
CN-103259044-A Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery MITSUBISHI CHEM CORP 2013-08-21 CN disclosed
CN-101432923-B Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery MITSUBISHI CHEM CORP 2012-04-18 CN disclosed
US-20110198105-A1 NON-HALOGEN FLAME RETARDANT RESIN COMPOSITION AND ELECTRIC WIRE AND CABLE USING THE SAME HITACHI CABLE, LTD. (JP) 2011-08-18 US disclosed
CN-102097654-A Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery MITSUBISHI CHEM CORP 2011-06-15 CN disclosed
CN-101432923-A Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery MITSUBISHI CHEM CORP (JP) 2009-05-13 CN disclosed