SCHEMBL22974919

SCHEMBL22974919

CCCCO[Ti](OCCCC)(ON1C(=O)CCC1=O)ON1C(=O)CCC1=O

nearest known ligand 0.33

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
▸ SMN1; SMN2 Q16637 2/20 0.33
▸ KMT2A Q03164 1/20 0.33
▸ ALOX12 P18054 1/20 0.33
▸ FAAH O00519 2/20 0.32
▸ MGLL Q99685 2/20 0.32
▸ TDP1 Q9NUW8 1/20 0.31
▸ LMNA P02545 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22974952 0.96 SMN1; SMN2 (0.33) SMN1; SMN2KMT2AALOX12FAAHMGLL
SCHEMBL22974936 0.89 ALOX12 (0.31) ALOX12
SCHEMBL22974946 0.85 ALOX12 (0.31) ALOX12
SCHEMBL22974932 0.81 LMNA (0.34) LMNA
SCHEMBL22974951 0.77 LMNA (0.34) LMNA
SCHEMBL12501215 0.75 ALOX12 (0.53) SMN1; SMN2KMT2AALOX12FAAHMGLL
SCHEMBL22974926 0.73 TDP1 (0.50) TDP1
SCHEMBL22974922 0.73 PIK3CD (0.32) KMT2ATDP1LMNA
SCHEMBL22974931 0.70 POLB (0.32) —
SCHEMBL22974956 0.70 POLB (0.32) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3778715-B1 POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD TORAY INDUSTRIES (JP) 2022-05-25 — — EP disclosed
US-20210371599-A1 POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD TORAY INDUSTRIES, INC. (JP) 2021-12-02 — — US disclosed
EP-3778715-A1 POLYMETALLOXANE, COMPOSITION, CURED FILM, MEMBER, ELECTRONIC COMPONENT, FIBER, BINDER FOR CERAMIC MOLDING, CURED FILM PRODUCTION METHOD, AND FIBER PRODUCTION METHOD Toray Industries, Inc. (JP) 2021-02-17 — — EP disclosed
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