SCHEMBL22975126

SCHEMBL22975126

CCO[Si]1(OCC)CCC1(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21113726 0.84
SCHEMBL27583530 0.66
SCHEMBL648224 0.65
SCHEMBL27259201 0.63
SCHEMBL14117141 0.61
SCHEMBL2862870 0.60
SCHEMBL21679565 0.59
SCHEMBL3956499 0.58
SCHEMBL15157466 0.56
SCHEMBL6053267 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210050212-A1 Low-K Dielectric Films APPLIED MATERIALS, INC. (US) 2021-02-18 US claimed
WO-2025217018-A1 PRECURSOR, GAS MIXTURE, AND METHOD FOR DEPOSITING A LOW K DIELECTRIC FILM APPLIED MATERIALS, INC. (US) 2025-10-16 WO disclosed
US-20250313950-A1 PRECURSOR, GAS MIXTURE, AND METHOD FOR DEPOSITING A LOW K DIELECTRIC FILM APPLIED MATERIALS, INC. 2025-10-09 US disclosed
US-20250293017-A1 METHODS OF FORMING CONFORMAL SILICON OXYCARBONITRIDE THIN FILMS ON HIGH ASPECT RATIO SEMICONDUCTOR STRUCTURES APPLIED MATERIALS, INC. (US) 2025-09-18 US disclosed
US-11393678-B2 Low-k dielectric films APPLIED MATERIALS, INC. (US) 2022-07-19 US disclosed
US-20210050212-A1 Low-K Dielectric Films APPLIED MATERIALS, INC. (US) 2021-02-18 US disclosed