SCHEMBL2297964

SCHEMBL2297964

O=C(OC(Cl)c1ccc(O)cc1)c1ccccc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 3/20 0.60
ESR2 Q92731 3/20 0.60
TSHR P16473 2/20 0.50
TP53 P04637 1/20 0.50
CA12 O43570 1/20 0.49
CA1 P00915 1/20 0.49
CA2 P00918 1/20 0.49
CA7 P43166 1/20 0.49
CA9 Q16790 1/20 0.49
CA14 Q9ULX7 1/20 0.49
CES2 O00748 1/20 0.46
LMNA P02545 5/20 0.45
MIF P14174 1/20 0.44
F2 P00734 1/20 0.44
SLC6A3 Q01959 4/20 0.43
SLC6A4 P31645 3/20 0.43
SLC6A2 P23975 3/20 0.43
ALDH1A1 P00352 4/20 0.43
KMT2A Q03164 4/20 0.43
MAPT P10636 3/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2037987 0.93 ESR1 (0.70) ESR1ESR2TSHRTP53CA12
SCHEMBL5421978 0.89 TSHR (0.57) ESR1ESR2TSHRTP53CES2
SCHEMBL9481140 0.85 ESR1 (0.59) ESR1ESR2TSHRTP53CA12
SCHEMBL891147 0.82 ESR1 (0.64) ESR1ESR2TSHRTP53CA12
SCHEMBL10499313 0.82 NPC1 (0.61) TSHRTP53CA1CA2CES2
SCHEMBL8711193 0.80 ESR1 (0.54) ESR1ESR2TSHRCA12CA1
SCHEMBL891146 0.77 ESR1 (0.72) ESR1ESR2TSHRTP53CA12
SCHEMBL28388652 0.76 MAPT (0.65) ESR1ESR2CA1CA2CES2
SCHEMBL11901966 0.76 ESR1 (0.55) ESR1ESR2TSHRTP53CA12
SCHEMBL9739234 0.75 TSHR (0.63) ESR1ESR2TSHRTP53CES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7993732-B2 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2011-08-09 US disclosed
US-20080026205-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2008-01-31 US disclosed
EP-1882726-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2008-01-30 EP disclosed