SCHEMBL23051186

SCHEMBL23051186

C=C(C)C(=O)Sc1ccc(Sc2ccc(SC(=O)C(=C)C)c(C)c2)cc1C

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 5/20 0.36
ALDH1A1 P00352 4/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
MAPT P10636 2/20 0.36
OPRM1 P35372 1/20 0.36
OPRD1 P41143 1/20 0.36
KMT2A Q03164 1/20 0.36
LMNA P02545 2/20 0.36
L3MBTL1 Q9Y468 2/20 0.36
PKM P14618 1/20 0.34
GFER P55789 1/20 0.32
RXRA P19793 1/20 0.32
RXRB P28702 1/20 0.32
RXRG P48443 1/20 0.32
ICAM1 P05362 2/20 0.32
SELE P16581 2/20 0.32
HSP90AA1 P07900 2/20 0.30
BCL2 P10415 1/20 0.30
MCL1 Q07820 1/20 0.30
CASP6 P55212 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16170586 0.83 MCL1 (0.30) MCL1
SCHEMBL16170333 0.83 MCL1 (0.30) MCL1
SCHEMBL16170398 0.79 TTR (0.37) SMN1; SMN2MAPTKMT2ALMNAPKM
SCHEMBL16170411 0.79 ACACB (0.33) HPGDALDH1A1SMN1; SMN2KMT2AKDM4E
SCHEMBL7521861 0.77 LMNA (0.31) HPGDLMNAL3MBTL1
SCHEMBL23051185 0.77 HPGD (0.36) HPGDALDH1A1SMN1; SMN2MAPTOPRM1
SCHEMBL158581 0.76 HPGD (0.50) HPGDALDH1A1SMN1; SMN2MAPTKMT2A
SCHEMBL16170373 0.76
SCHEMBL16170480 0.76
SCHEMBL4908186 0.75 CA12 (0.39) HPGDALDH1A1SMN1; SMN2MAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 US disclosed
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 US disclosed
WO-2023120077-A1 COMPOSITION, AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 WO disclosed
WO-2023120076-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 WO disclosed
WO-2023074264-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 WO disclosed
WO-2023074266-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 WO disclosed
WO-2023074265-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 WO disclosed
WO-2023058418-A1 COMPOSITION, AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-04-13 WO disclosed
US-20230056225-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-23 US disclosed
US-20230038195-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-09 US disclosed
US-20230028822-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-26 US disclosed
US-20230002520-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-05 US disclosed
US-20220404709-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2022-12-22 US disclosed
WO-2022181562-A1 PHOTOCURABLE LIQUID COMPOSITION, CURED OBJECT, AND METHOD FOR PRODUCING CURED OBJECT 東京応化工業株式会社 2022-09-01 WO disclosed
EP-4019558-A1 CURABLE INK COMPOSITION, CURED MATERIAL AND NANOCOMPOSITE TOKYO OHKA KOGYO CO., LTD. (JP) 2022-06-29 EP disclosed
WO-2021106683-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT 東京応化工業株式会社 2021-06-03 WO disclosed
WO-2021106684-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT 東京応化工業株式会社 2021-06-03 WO disclosed
WO-2021039783-A1 CURABLE INK COMPOSITION, CURED MATERIAL AND NANOCOMPOSITE 東京応化工業株式会社 2021-03-04 WO disclosed