SCHEMBL23051185

SCHEMBL23051185

C=CC(=O)Sc1ccc(Sc2ccc(SC(=O)C=C)c(C)c2)cc1C

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 4/20 0.36
ALDH1A1 P00352 3/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
MAPT P10636 2/20 0.36
OPRM1 P35372 1/20 0.36
OPRD1 P41143 1/20 0.36
KMT2A Q03164 1/20 0.36
RXRA P19793 2/20 0.35
RXRB P28702 2/20 0.35
RXRG P48443 2/20 0.35
GFER P55789 1/20 0.35
PKM P14618 1/20 0.34
LMNA P02545 2/20 0.32
L3MBTL1 Q9Y468 2/20 0.32
ICAM1 P05362 2/20 0.32
SELE P16581 2/20 0.32
RARB P10826 1/20 0.31
RARG P13631 1/20 0.31
HSP90AA1 P07900 2/20 0.30
BCL2 P10415 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25711609 0.89 MAPT (0.35) HPGDALDH1A1SMN1; SMN2MAPTOPRM1
SCHEMBL16170479 0.83 MCL1 (0.33) RXRARXRBRXRGRARBMCL1
SCHEMBL16170338 0.83 MCL1 (0.33) RXRARXRBRXRGRARBMCL1
SCHEMBL16170502 0.80 TTR (0.38) RARBRARG
SCHEMBL16170457 0.79 HNF4A (0.31) RARBRARG
SCHEMBL7521449 0.77
SCHEMBL23051186 0.77 HPGD (0.36) HPGDALDH1A1SMN1; SMN2MAPTOPRM1
SCHEMBL16170496 0.76
SCHEMBL16170428 0.76
SCHEMBL16170401 0.75 KMT2A (0.39) HPGDALDH1A1MAPTKMT2ARXRA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 US disclosed
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 US disclosed
WO-2023120076-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 WO disclosed
WO-2023074265-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 WO disclosed
WO-2023074266-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 WO disclosed
WO-2023074264-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 WO disclosed
WO-2023058418-A1 COMPOSITION, AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-04-13 WO disclosed
WO-2023047855-A1 COMPOSITION AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-03-30 WO disclosed
US-20230038195-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-09 US disclosed
US-20230028822-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-26 US disclosed
US-20230002520-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-05 US disclosed
US-20220404709-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2022-12-22 US disclosed
WO-2022181562-A1 PHOTOCURABLE LIQUID COMPOSITION, CURED OBJECT, AND METHOD FOR PRODUCING CURED OBJECT 東京応化工業株式会社 2022-09-01 WO disclosed
EP-4019558-A1 CURABLE INK COMPOSITION, CURED MATERIAL AND NANOCOMPOSITE TOKYO OHKA KOGYO CO., LTD. (JP) 2022-06-29 EP disclosed
WO-2021106684-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT 東京応化工業株式会社 2021-06-03 WO disclosed
WO-2021106683-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL, AND METHOD FOR PRODUCING CURED PRODUCT 東京応化工業株式会社 2021-06-03 WO disclosed
WO-2021106806-A1 PHOTOSENSITIVE INK COMPOSITION, CURED PRODUCT, DISPLAY PANEL AND METHOD FOR PRODUCING CURED PRODUCT 東京応化工業株式会社 2021-06-03 WO disclosed
WO-2021039783-A1 CURABLE INK COMPOSITION, CURED MATERIAL AND NANOCOMPOSITE 東京応化工業株式会社 2021-03-04 WO disclosed