⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22205178 | 0.77 | MAPK1 (0.45) | — | |
| SCHEMBL22205119 | 0.73 | CYP1A2 (0.46) | — | |
| SCHEMBL31434861 | 0.72 | HTT (0.36) | — | |
| SCHEMBL31434843 | 0.72 | HTT (0.36) | — | |
| SCHEMBL23071505 | 0.72 | PTGS2 (0.30) | — | |
| SCHEMBL31434864 | 0.72 | ALDH1A1 (0.52) | — | |
| SCHEMBL22205145 | 0.71 | MAPK1 (0.43) | — | |
| SCHEMBL22205093 | 0.71 | MAPK1 (0.43) | — | |
| SCHEMBL23071447 | 0.71 | — | — | |
| SCHEMBL22205156 | 0.71 | MAPK1 (0.43) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4459007-A1 | ORGANIC COATING AND METHOD FOR PRODUCING SAME | SHIKOKU CHEMICALS CORPORATION (JP) | 2024-11-06 | — | — | EP | disclosed |
| CN-118475721-A | Surface treatment liquid for metal | 四国化成工业株式会社 | 2024-08-09 | — | — | CN | disclosed |
| CN-118414453-A | Organic coating and method for producing same | 四国化成工业株式会社 | 2024-07-30 | — | — | CN | disclosed |
| CN-114341401-B | Surface treatment liquid for metal, concentrated liquid thereof, surface treatment liquid set for metal, surface treatment method, and method for producing printed wiring board | 四国化成工业株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-114341401-A | Metal surface treatment liquid and concentrated liquid thereof, metal surface treatment liquid set and surface treatment method, and printed wiring board manufacturing method | 四国化成工业株式会社 | 2022-04-12 | — | — | CN | disclosed |
| WO-2021045055-A1 | METAL SURFACE TREATMENT SOLUTION AND LIQUID CONCENTRATE THEREOF, METAL SURFACE TREATMENT SOLUTION SET, METAL SURFACE TREATMENT METHOD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | 四国化成工業株式会社 | 2021-03-11 | — | — | WO | disclosed |