⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2315077 | 0.95 | — | — | |
| SCHEMBL2312454 | 0.95 | — | — | |
| SCHEMBL285341 | 0.83 | TSHR (0.32) | — | |
| SCHEMBL2310384 | 0.78 | LMNA (0.32) | — | |
| SCHEMBL28806148 | 0.77 | — | — | |
| SCHEMBL7107926 | 0.76 | — | — | |
| SCHEMBL2312814 | 0.76 | — | — | |
| SCHEMBL14260925 | 0.76 | — | — | |
| SCHEMBL2314570 | 0.76 | — | — | |
| SCHEMBL29139415 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12145937-B2 | Process for preparing bicyclic guanidines | WACKER CHEMIE AG (DE) | 2024-11-19 | — | — | US | disclosed |
| US-12109812-B2 | Ink jet printing method and ink jet printing apparatus | SEIKO EPSON CORPORATION (JP) | 2024-10-08 | — | — | US | disclosed |
| US-20220032618-A1 | Ink Jet Printing Method And Ink Jet Printing Apparatus | SEIKO EPSON CORPORATION (JP) | 2022-02-03 | — | — | US | disclosed |
| US-20210214367-A1 | PROCESS FOR PREPARING BICYCLIC GUANIDINES | WACKER CHEMIE AG (DE) | 2021-07-15 | — | — | US | disclosed |
| EP-3774807-A1 | PROCESS FOR PREPARING BICYCLIC GUANIDINES | Wacker Chemie AG (DE) | 2021-02-17 | — | — | EP | disclosed |
| US-10300708-B2 | Ink jet composition, housing, and ink jet method | SEIKO EPSON CORPORATION (JP) | 2019-05-28 | — | — | US | disclosed |
| US-20170058138-A1 | INK JET COMPOSITION, HOUSING, AND INK JET METHOD | SEIKO EPSON CORPORATION (JP) | 2017-03-02 | — | — | US | disclosed |
| US-20160339602-A1 | METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE | SEIKO EPSON CORPORATION (JP) | 2016-11-24 | — | — | US | disclosed |
| US-20160263829-A1 | THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM | SEIKO EPSON CORPORATION (JP) | 2016-09-15 | — | — | US | disclosed |
| US-20160107385-A1 | THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING METHOD AND THREE-DIMENSIONAL SHAPED OBJECT | SEIKO EPSON CORPORATION (JP) | 2016-04-21 | — | — | US | disclosed |
| US-20100239776-A1 | METHOD FOR PRODUCING PLASTIC LENS | HOYA CORPORATION (JP) | 2010-09-23 | — | — | US | disclosed |
| EP-2168757-A1 | METHOD FOR PRODUCING PLASTIC LENS | Hoya Corporation (JP) | 2010-03-31 | — | — | EP | disclosed |
| US-20090226609-A1 | Silicone Resin and Silicone Composition | DOW CORNING CORPORATION | 2009-09-10 | — | — | US | disclosed |
| US-20090077798-A1 | METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20090071706-A1 | METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-19 | — | — | US | disclosed |
| US-7500895-B2 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2009-03-10 | — | — | US | disclosed |
| US-20080317943-A1 | METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | SEIKO EPSON CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20080311285-A1 | CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD | SEIKO EPSON CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20060127563-A1 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| US-20050287392-A1 | Organic electroluminescent device, method for producing the same, and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2005-12-29 | — | — | US | disclosed |