SCHEMBL2315077

SCHEMBL2315077

CCO[Si](OCC)(OC(C)CC)OC(C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2312454 0.95
SCHEMBL2314641 0.95
SCHEMBL285341 0.83 TSHR (0.32)
SCHEMBL2316249 0.78 LMNA (0.32)
SCHEMBL28806148 0.77
SCHEMBL7107926 0.76
SCHEMBL2312814 0.76
SCHEMBL2314570 0.76
SCHEMBL29139415 0.76
SCHEMBL14260925 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4338133-A Jet printing ink composition DAI NIPPON TORYO CO., LTD. (JP) 1982-07-06 US claimed
US-12145937-B2 Process for preparing bicyclic guanidines WACKER CHEMIE AG (DE) 2024-11-19 US disclosed
US-20210214367-A1 PROCESS FOR PREPARING BICYCLIC GUANIDINES WACKER CHEMIE AG (DE) 2021-07-15 US disclosed
EP-3774807-A1 PROCESS FOR PREPARING BICYCLIC GUANIDINES Wacker Chemie AG (DE) 2021-02-17 EP disclosed
US-7989030-B2 Silicone resin and silicone composition DOW CORNING CORPORATION (US) 2011-08-02 US disclosed
US-20090226609-A1 Silicone Resin and Silicone Composition DOW CORNING CORPORATION 2009-09-10 US disclosed
EP-2046893-A2 SILICONE RESIN AND SILICONE COMPOSITION Dow Corning Corporation (US) 2009-04-15 EP disclosed
WO-2008018981-A2 SILICONE RESIN AND SILICONE COMPOSITION DOW CORNING CORPORATION (US) 2008-02-14 WO disclosed
US-4338133-A Jet printing ink composition DAI NIPPON TORYO CO., LTD. (JP) 1982-07-06 US disclosed