SCHEMBL2316249

SCHEMBL2316249

CCO[Si](OCC)(OC(C)C)OC(C)C

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2310384 0.94 LMNA (0.32) LMNA
SCHEMBL633696 0.94 LMNA (0.32) LMNA
SCHEMBL22282991 0.92 LMNA (0.30) LMNA
SCHEMBL6894573 0.87
SCHEMBL25253492 0.81
SCHEMBL28091676 0.81
SCHEMBL25291725 0.81
SCHEMBL25317268 0.78 HSD17B10 (0.32)
SCHEMBL2315077 0.78
SCHEMBL439734 0.74 LMNA (0.30) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4338133-A Jet printing ink composition DAI NIPPON TORYO CO., LTD. (JP) 1982-07-06 US claimed
EP-3898820-B1 POLYMERIC COMPOSITIONS WITH HIGH DIELECTRIC CONSTANT AND LOW DIELECTRIC LOSS CELANESE POLYMERS HOLDINGS INC (US) 2025-05-28 EP disclosed
US-12247123-B2 Polymeric compositions with high dielectric constant and low dielectric loss CELANESE POLYMERS HOLDING, INC. (US) 2025-03-11 US disclosed
EP-4093817-B1 POLYMER COMPOSITE WITH LOW DIELECTRIC CONSTANT DUPONT POLYMERS INC (US) 2024-04-10 EP disclosed
CN-117075425-A Polysiloxane composition, composition for forming film, laminate, touch panel, and method for forming cured film 阪田油墨株式会社 2023-11-17 CN disclosed
CN-117069942-A Polysiloxane compound, composition for forming film, laminate, touch panel, and method for forming cured film 阪田油墨株式会社 2023-11-17 CN disclosed
US-20230340234-A1 POLYMER COMPOSITE WITH LOW DIELECTRIC CONSTANT DUPONT POLYMERS INC (US) 2023-10-26 US disclosed
CN-116804825-A Composition for forming silicon-containing metal hard mask and pattern forming method 信越化学工业株式会社 2023-09-26 CN disclosed
CN-111208710-B Iodine-containing thermosetting silicon-containing material, resist underlayer film forming composition for extreme ultraviolet lithography containing the same, and pattern forming method 信越化学工业株式会社 2023-08-22 CN disclosed
CN-116554651-A Polymer composite with low dielectric constant 杜邦聚合物有限公司 2023-08-08 CN disclosed
US-7989030-B2 Silicone resin and silicone composition DOW CORNING CORPORATION (US) 2011-08-02 US disclosed
US-20090226609-A1 Silicone Resin and Silicone Composition DOW CORNING CORPORATION 2009-09-10 US disclosed
CN-101501139-A Silicone resin and silicone composition DOW CORNING (US) 2009-08-05 CN disclosed
EP-2046893-A2 SILICONE RESIN AND SILICONE COMPOSITION Dow Corning Corporation (US) 2009-04-15 EP disclosed
WO-2008018981-A2 SILICONE RESIN AND SILICONE COMPOSITION DOW CORNING CORPORATION (US) 2008-02-14 WO disclosed
EP-1141044-A1 SOLID CATALYST COMPONENT FOR OLEFIN POLYMERIZATION, CATALYST FOR OLEFIN POLYMERIZATION AND PROCESS FOR PRODUCING OLEFIN POLYMER Basell Technology Company B.V. (NL) 2001-10-10 EP disclosed
WO-2001036496-A1 SOLID CATALYST COMPONENT FOR OLEFIN POLYMERIZATION, CATALYST FOR OLEFIN POLYMERIZATION AND PROCESS FOR PRODUCING OLEFIN POLYMER BASELL TECHNOLOGY COMPANY B.V. (NL) 2001-05-25 WO disclosed
US-5113109-A Glass of titanium oxide and antimony, silicon or tantalum additive, two layers with a different refractive index TOSHIBA LIGHTING & TECHNOLOGY CORPORATION (JP) 1992-05-12 US disclosed
US-4634919-A OPTICAL INTERFERENCE COATING OF TITANIUM OXIDE KABUSHIKI KAISHA TOSHIBA (JP) 1987-01-06 US disclosed
US-4338133-A Jet printing ink composition DAI NIPPON TORYO CO., LTD. (JP) 1982-07-06 US disclosed