SCHEMBL2322136

SCHEMBL2322136

CCc1ccc(C(N)(N)CC)c(CC)c1CC

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 1/20 0.31
GABRB2 P47870 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL28418842 0.82 GABRA1 (0.30) GABRA1GABRB2
SCHEMBL30498855 0.82 GABRA1 (0.43) GABRA1GABRB2
SCHEMBL11081926 0.82 GABRA1 (0.43) GABRA1GABRB2
SCHEMBL10860534 0.79 GABRA1 (0.33) GABRA1GABRB2
SCHEMBL1965065 0.75 GABRA1 (0.38) GABRA1GABRB2
SCHEMBL166573 0.75 GABRA1 (0.41) GABRA1GABRB2
SCHEMBL29619533 0.75 GABRA1 (0.41) GABRA1GABRB2
Ammonia Solution, Strong SCHEMBL27539208 0.72 GABRA1 (0.39) GABRA1GABRB2
SCHEMBL15271 0.71 GABRA1 (0.43) GABRA1GABRB2
SCHEMBL8522728 0.71 KIF11 (0.35) GABRA1GABRB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107250172-B Modified conjugated diene polymer, method for producing same, and modified conjugated diene polymer composition 旭化成株式会社 2021-04-09 CN disclosed
CN-109384982-B Modified conjugated diene polymer composition and tire 旭化成株式会社 2020-11-17 CN disclosed
WO-2020040200-A1 PREPREG 東レ株式会社 2020-02-27 WO disclosed
CN-109384981-A Modified conjugated diene rubber composition and tire 旭化成株式会社 2019-02-26 CN disclosed
CN-109384982-A Modified conjugated diene polymer composition and tire 旭化成株式会社 2019-02-26 CN disclosed
CN-108164645-A MODIFIED CONJUGATED DIENE POLYMER, MODIFIED CONJUGATED DIENE POLYMER COMPOSITION AND TIRE 旭化成株式会社 2018-06-15 CN disclosed
CN-107250172-A Modified conjugated diene polymer and its manufacture method and modified conjugated diene polymer composition 旭化成株式会社 2017-10-13 CN disclosed
US-8759411-B2 Derivatives of diphosphines as flame retardants for polyurethanes BASF SE (DE) 2014-06-24 US disclosed
EP-2531554-A1 DERIVATIVES OF DIPHOSPHINES AS FLAME RETARDANTS FOR POLYURETHANES BASF SE (DE) 2012-12-12 EP disclosed
US-20110190407-A1 DERIVATIVES OF DIPHOSPHINES AS FLAME RETARDANTS FOR POLYURETHANES BASF SE (DE) 2011-08-04 US disclosed
US-20090184431-A1 Liquid epoxy resin composition and flip chip semiconductor device SHIN-ETSU CHEMICAL CO., LTD. 2009-07-23 US disclosed
US-7169833-B2 shell-core polymer containing (meth)acrylate ; aromatic amine curing agent; glass transition temperature; controlling particle size; sealant for flip chips SHIN-ESTU CHEMICAL CO., LTD. (JP) 2007-01-30 US disclosed
US-7147920-B2 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-12-12 US disclosed
US-20060217499-A1 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. 2006-09-28 US disclosed
US-20060204762-A1 Liquid epoxy resin composition and semiconductor device SUMITA KAZUAKI 2006-09-14 US disclosed
US-7094844-B2 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-08-22 US disclosed
US-20050152773-A1 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. 2005-07-14 US disclosed
US-20040227255-A1 Liquid epoxy resin composition and flip chip semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-11-18 US disclosed
US-20040105990-A1 Wafer dicing/die bonding sheet SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-06-03 US disclosed
US-20040054061-A1 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-03-18 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090184431-A1 Liquid epoxy resin composition and flip chip semiconductor device ASH2L, ARID2, ASH1L GABRA1 3382/4885GABRB2 3284/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.