Hydrochloric Acid

Hydrochloric Acid

SCHEMBL232267

CCCCCCCCCCCCn1cc[n+](Cc2ccccc2)c1C.[Cl-]

nearest known ligand 0.97

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EEF2K O00418 3/20 0.97
EEF2 P13639 2/20 0.97
MEN1 O00255 2/20 0.97
KMT2A Q03164 2/20 0.97
PLK4 O00444 1/20 0.97
JAK2 O60674 1/20 0.97
EGFR P00533 1/20 0.97
TYK2 P29597 1/20 0.97
FLT3 P36888 1/20 0.97
BLM P54132 1/20 0.97
ITK Q08881 1/20 0.97
PIM2 Q9P1W9 1/20 0.97
CA1 P00915 10/20 0.71
CA2 P00918 10/20 0.71
APAF1 O14727 1/20 0.44
TLR8 Q9NR97 2/20 0.39
KCNH2 Q12809 1/20 0.38
KCNA3 P22001 1/20 0.37
TP53 P04637 1/20 0.37
MAPK1 P28482 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL4365302 1.00 EEF2K (0.97) EEF2KEEF2MEN1KMT2APLK4
Hydrochloric Acid SCHEMBL4362495 1.00 EEF2K (0.97) EEF2KEEF2MEN1KMT2APLK4
Hydrochloric Acid SCHEMBL4366988 1.00 EEF2K (0.97) EEF2KEEF2MEN1KMT2APLK4
SCHEMBL5302237 0.99 EEF2K (1.00) EEF2KEEF2MEN1KMT2APLK4
SCHEMBL5294286 0.99 EEF2K (1.00) EEF2KEEF2MEN1KMT2APLK4
SCHEMBL5329417 0.99 EEF2K (1.00) EEF2KEEF2MEN1KMT2APLK4
SCHEMBL5291762 0.99 EEF2K (1.00) EEF2KEEF2MEN1KMT2APLK4
SCHEMBL5813624 0.99 EEF2K (1.00) EEF2KEEF2MEN1KMT2APLK4
SCHEMBL5303928 0.99 EEF2K (1.00) EEF2KEEF2MEN1KMT2APLK4
SCHEMBL1895651 0.99 EEF2K (1.00) EEF2KEEF2MEN1KMT2APLK4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1324 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117727527-A Magnetic semi-fluid composition and inductor 深圳市优宝新材料科技有限公司 2024-03-19 CN claimed
EP-3331959-B1 ANIONIC CURABLE COMPOSITIONS DESIGNER MOLECULES INC (US) 2022-10-05 EP claimed
US-20220204696-A1 PHENOLIC FUNCTIONALIZED POLYIMIDES AND COMPOSITIONS THEREOF DESIGNER MOLECULES, INC 2022-06-30 US claimed
CN-108291122-B Anionically curable compositions 设计分子有限公司 2021-01-05 CN claimed
WO-2020219852-A1 PHENOLIC FUNCTIONALIZED POLYIMIDES AND COMPOSITIONS THEREOF DESIGNER MOLECULES, INC. (US) 2020-10-29 WO claimed
US-20180237668-A1 ANIONIC CURABLE COMPOSITIONS DESIGNER MOLECULES, INC. 2018-08-23 US claimed
US-20140066545-A1 EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-03-06 US claimed
US-20140034367-A1 EPOXY RESIN COMPOSITION FOR PRITNED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-02-06 US claimed
US-20140014402-A1 EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-01-16 US claimed
CN-102153837-B High-performance high-temperature-resistant modified epoxy resin SHANGHAI MASTECK ECOLOGY SCIENCE TECHNOLOGY CO LTD 2012-09-05 CN claimed
CN-102153837-A High-performance high-temperature-resistant modified epoxy resin SHANGHAI MASTECK ECOLOGY SCIENCE TECHNOLOGY CO LTD 2011-08-17 CN claimed
US-3931129-A FLUOROELASTOMER COMPOSITION DAIKIN KOGYO CO., LTD. (JA) 1976-01-06 US claimed
CN-113347793-B Method for manufacturing printed wiring board 味之素株式会社 2026-05-19 CN disclosed
US-12617907-B2 Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-05-05 US disclosed
EP-4190439-B1 MICROCAPSULE PRODUCTION METHOD MORISHITA JINTAN CO (JP) 2026-04-29 EP disclosed
EP-4734673-A1 WIRING BOARD Resonac Corporation (JP) 2026-04-29 EP disclosed
US-4228124-A Fumigating method and apparatus EARTH CHEMICAL COMPANY (JP) 1980-10-14 US disclosed
US-4171340-A BLOWING AGENT WHICH DECOMPOSES TO NITROGEN EARTH CHEMICAL COMPANY, LTD. (JP) 1979-10-16 US disclosed
US-4163038-A ACTIVE INGREDIENT AND BLOWING AGENT EARTH CHEMICAL COMPANY, LIMITED (JP) 1979-07-31 US disclosed
US-3931129-A FLUOROELASTOMER COMPOSITION DAIKIN KOGYO CO., LTD. (JA) 1976-01-06 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12617907-B2 Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board SUZ12, RXRB, RXRG EEF2K 3309/4885EEF2 2284/4885MEN1 2649/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.