Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5085588 | 0.82 | CYP3A4 (0.46) | ALDH1A1CYP3A4TSHR | |
| SCHEMBL31090300 | 0.79 | ALDH1A1 (0.46) | ALDH1A1CYP3A4TSHR | |
| SCHEMBL2414727 | 0.79 | LPAR3 (0.41) | — | |
| SCHEMBL1921641 | 0.72 | ALDH1A1 (0.43) | ALDH1A1CYP3A4TSHR | |
| SCHEMBL11767940 | 0.72 | ALDH1A1 (0.50) | ALDH1A1CYP3A4TSHR | |
| SCHEMBL9579408 | 0.71 | TSHR (0.38) | ALDH1A1CYP3A4TSHR | |
| SCHEMBL21906333 | 0.69 | ALDH1A1 (0.40) | ALDH1A1CYP3A4TSHR | |
| SCHEMBL21906302 | 0.69 | ALDH1A1 (0.40) | ALDH1A1CYP3A4TSHR | |
| SCHEMBL2141473 | 0.67 | ALDH1A1 (0.50) | ALDH1A1CYP3A4TSHR | |
| SCHEMBL11585600 | 0.65 | LPAR3 (0.48) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4726011-A1 | FLAME RETARDANT, COMPOSITION, AND MOLDED ARTICLE | ADEKA CORPORATION (JP) | 2026-04-15 | — | — | EP | disclosed |
| WO-2024252972-A1 | FLAME RETARDANT, COMPOSITION, AND MOLDED ARTICLE | 株式会社ADEKA | 2024-12-12 | — | — | WO | disclosed |
| US-10123412-B2 | Thermosetting polymer formulations, circuit materials, and methods of use thereof | ROGERS CORPORATION (US) | 2018-11-06 | — | — | US | disclosed |
| US-20170218171-A1 | THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF | JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT | 2017-08-03 | — | — | US | disclosed |
| WO-2017132310-A1 | THERMOSETTING POLYMER FORMULATIONS, CIRCUIT MATERIALS, AND METHODS OF USE THEREOF | ROGERS CORPORATION (US) | 2017-08-03 | — | — | WO | disclosed |
| EP-2392603-B1 | EPOXY RESIN COMPOSITION, CURING AGENT, AND CURING ACCELERATOR | NIPPON SODA CO (JP) | 2017-07-26 | — | — | EP | disclosed |
| EP-2489689-B1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NIPPON SODA CO (JP) | 2017-05-10 | — | — | EP | disclosed |
| US-9068074-B2 | Composition for formation of cured epoxy resin, and cured products thereof | NIPPON SODA CO., LTD. (JP) | 2015-06-30 | — | — | US | disclosed |
| US-9023956-B2 | Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor | NIPPON SODA CO., LTD. (JP) | 2015-05-05 | — | — | US | disclosed |
| EP-2476710-B1 | METHOD FOR PRODUCING POLYBUTADIENE | NIPPON SODA CO (JP) | 2015-03-18 | — | — | EP | disclosed |
| US-20130059942-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | NIPPON SODA CO., LTD. (JP) | 2013-03-07 | — | — | US | disclosed |
| EP-2489689-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | Nippon Soda Co., Ltd. (JP) | 2012-08-22 | — | — | EP | disclosed |
| US-20120202910-A1 | METHOD FOR PRODUCING POLYBUTADIENE | NIPPON SODA CO., LTD. (JP) | 2012-08-09 | — | — | US | disclosed |
| US-20120196991-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) | 2012-08-02 | — | — | US | disclosed |
| EP-2476710-A1 | METHOD FOR PRODUCING POLYBUTADIENE | Nippon Soda Co., Ltd. (JP) | 2012-07-18 | — | — | EP | disclosed |
| EP-2410001-A1 | INCLUSION COMPLEX, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR | Nippon Soda Co., Ltd. (JP) | 2012-01-25 | — | — | EP | disclosed |
| US-20120004349-A1 | Epoxy resin composition, curing agent, and curing accelerator | NIPPON SODA CO., LTD. | 2012-01-05 | — | — | US | disclosed |
| US-20120004377-A1 | CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR | NIPPON SODA CO., LTD. | 2012-01-05 | — | — | US | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20120004377-A1 | CLATHRATE, CURING AGENT, CURE ACCELERATOR, EPOXY RESIN COMPOSITION, AND EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR | SEM1, RCC1, BMI1 | ALDH1A1 619/4885CYP3A4 2727/4885TSHR 4464/4885 |
| US-20120004349-A1 | Epoxy resin composition, curing agent, and curing accelerator | DCTN1, ARCN1, UNC119 | ALDH1A1 338/4885CYP3A4 2486/4885TSHR 4259/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.