SCHEMBL232432

SCHEMBL232432

CCCN[Si](NCCC)(NCCC)NCCC

nearest known ligand 0.33

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ADH1B P00325 1/20 0.33
ADH1A P07327 1/20 0.33
ADH7 P40394 1/20 0.33
CA1 P00915 1/20 0.33
ALDH1A1 P00352 1/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL233758 0.90 ADH1B (0.35) ADH1BADH1AADH7TSHR
SCHEMBL234564 0.90 ADH1B (0.35) ADH1BADH1AADH7TSHR
SCHEMBL232307 0.90 ADH1B (0.35) ADH1BADH1AADH7TSHR
SCHEMBL235198 0.87 TSHR (0.41) ADH1BADH1AADH7CA1ALDH1A1
SCHEMBL234957 0.87 TSHR (0.41) ADH1BADH1AADH7CA1ALDH1A1
SCHEMBL234094 0.83
SCHEMBL232301 0.83
SCHEMBL231649 0.83
SCHEMBL235945 0.81 EPHX1 (0.31)
SCHEMBL233914 0.79 TSHR (0.45) ADH1BADH1AADH7CA1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 255 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250313953-A1 METHODS AND SYSTEMS FOR FORMING DOPED SILICON NITRIDE FILMS ASM IP HOLDING B.V. (NL) 2025-10-09 US claimed
US-12378667-B2 Methods and systems for forming doped silicon nitride films ASM IP HOLDING B.V. (NL) 2025-08-05 US claimed
US-12232327-B2 Three-dimensional ferroelectric random-access memory (FeRAM) SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-02-18 US claimed
US-20230407477-A1 SUBSTRATE PROCESSING APPARATUS INCLUDING IMPROVED EXHAUST STRUCTURE ASM IP HOLDING B.V. (NL) 2023-12-21 US claimed
US-20230147421-A1 Three-Dimensional Ferroelectric Random-Access Memory (FeRAM) SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-05-11 US claimed
US-20230126516-A1 METHODS AND SYSTEMS FOR FORMING DOPED SILICON NITRIDE FILMS ASM IP HOLDING B.V. (NL) 2023-04-27 US claimed
US-20230089397-A1 AIR GAP FORMING METHOD AND SELECTIVE DEPOSITION METHOD ASM IP HOLDING B.V. (NL) 2023-03-23 US claimed
EP-3428959-B1 METHOD FOR PRODUCING SILICON NITRIDE FILM, AND SILICON NITRIDE FILM TAIYO NIPPON SANSO CORP (JP) 2023-03-01 EP claimed
US-20220282367-A1 FORMULATION FOR DEPOSITION OF SILICON DOPED HAFNIUM OXIDE VERSUM MATERIALS US, LLC (US) 2022-09-08 US claimed
EP-4013906-A1 FORMULATION FOR DEPOSITION OF SILICON DOPED HAFNIUM OXIDE Versum Materials US, LLC (US) 2022-06-22 EP claimed
US-20080242116-A1 Method for forming strained silicon nitride films and a device containing such films TOKYO ELECTRON LIMITED (JP) 2008-10-02 US claimed
US-20080241388-A1 Strained metal silicon nitride films and method of forming TOKYO ELECTRON LIMITED (JP) 2008-10-02 US claimed
US-20080081470-A1 Method for forming strained silicon nitride films and a device containing such films TOKYO ELECTRON LIMITED (JP) 2008-04-03 US claimed
EP-1714315-A2 NITRIDATION OF HIGH-K DIELECTRIC FILMS Aviza Technology, Inc. (US) 2006-10-25 EP claimed
US-20060062917-A1 Vapor deposition of hafnium silicate materials with tris(dimethylamino)silane APPLIED MATERIALS, INC. 2006-03-23 US claimed
US-20050239297-A1 Growth of high-k dielectrics by atomic layer deposition SENZAKI YOSHIHIDE 2005-10-27 US claimed
US-20050153571-A1 Nitridation of high-k dielectric films AVIZA TECHNOLOGY, INC. 2005-07-14 US claimed
WO-2005050715-A2 NITRIDATION OF HIGH-K DIELECTRIC FILMS AVIZA TECHNOLOGY, INC. (US) 2005-06-02 WO claimed
EP-1523763-A2 MOLECULAR LAYER DEPOSITION OF THIN FILMS WITH MIXED COMPONENTS Aviza Technology, Inc. (US) 2005-04-20 EP claimed
WO-2004010469-A2 ATOMIC LAYER DEPOSITION OF MULTI-METALLIC PRECURSORS AVIZA TECHNOLOGY, INC. (US) 2004-01-29 WO claimed