SCHEMBL2332482

SCHEMBL2332482

FC(F)C(F)C(F)C(F)C(F)(F)C(F)(F)C(F)I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21066245 0.92
SCHEMBL21986584 0.81
SCHEMBL4943535 0.80
SCHEMBL3695331 0.77
SCHEMBL8778686 0.75
SCHEMBL5186383 0.75
SCHEMBL1703274 0.70
SCHEMBL28456714 0.70
SCHEMBL21906295 0.70
SCHEMBL158454 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8003160-B2 Preventing undesired spreading of metal microparticles and disconnection using a liquid repellant membrane comprising a polyimide, silicone dioxide microparticles for surface roughness, and a perfluorinated polyether (Krytox) having either phenylamide ends or alkoxysilane terminal groups for solubility RICOH PRINTING SYSTEMS, LTD. (JP) 2011-08-23 US disclosed
US-20070154626-A1 Wiring substrate RICOH COMPANY, LTD. (JP) 2007-07-05 US disclosed
US-20050158528-A1 Wiring substrate RICOH PRINTING SYSTEMS, LTD. (JP) 2005-07-21 US disclosed