SCHEMBL233353

SCHEMBL233353

CC(=CC(C)C(CO)(CO)CO)C(=O)O.CCC(CO)(CO)CO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3759036 1.00
SCHEMBL8583779 0.76
SCHEMBL9160145 0.72
SCHEMBL3925432 0.72
Acetic Acid SCHEMBL3683188 0.71 FFAR3 (0.41)
Acetic Acid SCHEMBL5145909 0.71 FFAR3 (0.41)
Oxalic Acid SCHEMBL28437631 0.71 FFAR3 (0.35)
Acetic Acid SCHEMBL1321915 0.71 FFAR3 (0.41)
Acetic Acid SCHEMBL29697739 0.71 FFAR3 (0.41)
Acetic Acid SCHEMBL540582 0.71 FFAR3 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 332 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4338702-A1 NON-REACTIVE TRANSFER RAILS VOCO GmbH (DE) 2024-03-20 EP claimed
EP-4306099-A1 METHOD FOR PRODUCING DENTAL MILL BLANKS VOCO GmbH (DE) 2024-01-17 EP claimed
EP-3727797-B1 A HYBRID PHOTOPOLYMER COMPOSITION FOR ADDITIVE MANUFACTURING PERSTORP AB (SE) 2023-09-27 EP claimed
EP-3398202-B1 PHOTOSENSITIVE STACKED STRUCTURE FUJIFILM ELECTRONIC MAT USA INC (US) 2023-08-09 EP claimed
EP-3286605-B1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MAT USA INC (US) 2023-06-28 EP claimed
EP-3286606-B1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MAT USA INC (US) 2022-12-28 EP claimed
EP-3527605-B1 RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS AND FIBER-REINFORCED COMPOSITE MATERIAL USING SAME NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2021-12-01 EP claimed
US-11155669-B2 Curable resin composition, cured product thereof, and bonded body bonded by cured product THREEBOND CO., LTD. (JP) 2021-10-26 US claimed
EP-3480228-B1 COMPOSITION DENKA COMPANY LTD (JP) 2021-06-16 EP claimed
EP-3688128-B1 POLYMERIC THICKENER FOR IRIDESCENT LIQUID HAND SOAP COMPOSITIONS LUBRIZOL ADVANCED MAT INC (US) 2021-05-26 EP claimed
EP-2151229-A2 Infiltrant for dental application Ernst Mühlbauer GmbH & Co.KG (DE) 2010-02-10 EP claimed
EP-2145613-A1 Infiltrant for dental application Ernst Mühlbauer GmbH & Co.KG (DE) 2010-01-20 EP claimed
EP-1967903-B1 Photosensitive paste composition, barrier rib prepared using the composition and plasma display panel comprising the barrier rib SAMSUNG SDI CO LTD (KR) 2009-09-23 EP claimed
EP-1636274-B1 PHOTOCURABLE RESIN COMPOSITION DSM IP ASSETS BV (NL) 2009-08-12 EP claimed
EP-1660599-B1 RADIATION-CURABLE COMPOSITIONS FOR PIGMENTED INKS CYTEC SURFACE SPECIALTIES SA (BE) 2008-08-13 EP claimed
EP-1440097-B1 HIGH INDEX CURABLE PHOTOCHROMIC COMPOSITION AND ITS PROCESS RODENSTOCK GMBH (DE) 2008-03-12 EP claimed
EP-1678264-B1 RADIATION-CURABLE INKS FUJIFILM IMAGING COLORANTS LTD (GB) 2007-04-04 EP claimed
EP-1557455-A1 Thixotropic reactive composition Sika Technology AG (CH) 2005-07-27 EP claimed
EP-0813740-B1 REDUCED SOLVENT ANTISTATIC HARD COAT IMATION CORP A DELAWARE CORP (US) 1998-08-26 EP claimed
EP-0808498-B1 OVERCOAT FOR OPTICAL RECORDING MEDIUM IMATION CORP A DELAWARE CORP (US) 1998-08-12 EP claimed