SCHEMBL233455

SCHEMBL233455

CC1=CCCC(C(=O)O)(C(=O)OC(=O)C2(C(=O)O)CCC=C(C)C2(C(=O)O)C(=O)O)C1(C(=O)O)C(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL761120 0.88 FFAR3 (0.30)
SCHEMBL541537 0.68 CCR2 (0.33)
SCHEMBL23501559 0.66 CCR2 (0.36)
SCHEMBL6368919 0.65 FFAR3 (0.33)
SCHEMBL11252910 0.64 ALDH1A1 (0.31)
SCHEMBL10933220 0.62 FFAR3 (0.34)
SCHEMBL11757525 0.61 FFAR3 (0.36)
SCHEMBL1150181 0.61 FFAR3 (0.31)
SCHEMBL2122115 0.61 CYP2C19 (0.33)
SCHEMBL16694992 0.60 CCR2 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 149 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12043702-B2 Polymer, composition, molded article, cured product and laminate JSR CORPORATION (JP) 2024-07-23 US disclosed
CN-118234771-A Adhesive, laminate, and packaging material DIC株式会社 2024-06-21 CN disclosed
CN-118234824-A Adhesive, laminate, method for producing laminate, and packaging material DIC株式会社 2024-06-21 CN disclosed
CN-118055961-A Method for producing epoxy resin, epoxy resin composition, cured product, and electric/electronic component 三菱化学株式会社 2024-05-17 CN disclosed
WO-2024101359-A1 CURABLE COMPOSITION FOR INKJET, LED MODULE AND METHOD FOR PRODUCING LED MODULE 積水化学工業株式会社 2024-05-16 WO disclosed
WO-2024080335-A1 ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT 積水化学工業株式会社 2024-04-18 WO disclosed
WO-2024080336-A1 CURABLE COMPOSITION FOR INKJET USE AND FOR AIR CAVITY FORMATION, AND ELECTRONIC COMPONENT 積水化学工業株式会社 2024-04-18 WO disclosed
CN-117897462-A Adhesive, laminate, and packaging material DIC株式会社 2024-04-16 CN disclosed
CN-117897463-A Method for producing urethane prepolymer DIC株式会社 2024-04-16 CN disclosed
EP-3770202-B1 POLYMER, COMPOSITION, MOLDED ARTICLE, CURED PRODUCT AND LAMINATE JSR CORP (JP) 2024-02-21 EP disclosed
EP-0552376-B1 PRODUCTION OF POLYMER HYDROXYLATED AT BOTH TERMINALS, COMPOSITION CONTAINING SAID POLYMER AND ITS USE, AND POLYMER DERIVED FROM SAID COMPOSITION AND ITS USE NIPPON CATALYTIC CHEM IND (JP) 1999-01-13 EP disclosed
US-5516813-A ROTORS STARKEY DONN R (US) 1996-05-14 US disclosed
US-5470930-A Acid catalyzed addition polymerized composition NIPPON SHOKUBAI CO., LTD. (JP) 1995-11-28 US disclosed
US-5391665-A Catalyzed polymerization in the presence of a dihydroxypolysulfide compound NIPPON SHOKUBAI CO., LTD. (JP) 1995-02-21 US disclosed
US-5317067-A Melt mixing polyesters and adhesive epoxy resins and hardeners for sheets or films TOKYO TIRE & RUBBER COMPANY LIMITED (JP) 1994-05-31 US disclosed
EP-0579284-A2 Novel epoxy resins and electrostatographic toner containing the same as a binder MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1994-01-19 EP disclosed
US-5126188-A Curable epoxy resin blended with thermoplastic resin, filler and curing agent TOYO TIRE & RUBBER COMPANY LIMITED (JP) 1992-06-30 US disclosed
US-5124234-A Protective coating for printed circuits FUJI PHOTO FILM CO., LTD. (JP) 1992-06-23 US disclosed
US-5025067-A Low temperature fixing, offset resistance MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1991-06-18 US disclosed
EP-0317367-A2 Epoxy resins and electrostatographic toner containing the same as binder MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-05-24 EP disclosed