⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3030690 | 0.73 | TP53 (0.32) | — | |
| SCHEMBL4455803 | 0.66 | NPC1 (0.31) | — | |
| SCHEMBL486948 | 0.66 | KRAS (0.37) | — | |
| SCHEMBL346371 | 0.60 | CRBN (0.34) | — | |
| SCHEMBL8618030 | 0.60 | IDO1 (0.33) | — | |
| SCHEMBL9307153 | 0.60 | CRBN (0.34) | — | |
| SCHEMBL8619667 | 0.60 | CA1 (0.37) | — | |
| SCHEMBL8619722 | 0.58 | GRIN2D (0.33) | — | |
| SCHEMBL11549977 | 0.57 | CA1 (0.48) | — | |
| SCHEMBL8621451 | 0.57 | POLB (0.34) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 242 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12043702-B2 | Polymer, composition, molded article, cured product and laminate | JSR CORPORATION (JP) | 2024-07-23 | — | — | US | disclosed |
| US-12037511-B2 | Coating composition for electrical steel sheet, surface-coated electrical steel sheet for adhesion and laminated core | NIPPON STEEL CORPORATION (JP) | 2024-07-16 | — | — | US | disclosed |
| CN-113728031-B | Alicyclic epoxy compound product | 株式会社大赛璐 | 2024-07-02 | — | — | CN | disclosed |
| CN-118234771-A | Adhesive, laminate, and packaging material | DIC株式会社 | 2024-06-21 | — | — | CN | disclosed |
| CN-118234824-A | Adhesive, laminate, method for producing laminate, and packaging material | DIC株式会社 | 2024-06-21 | — | — | CN | disclosed |
| US-20240168385-A1 | PROTECTIVE FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2024-05-23 | — | — | US | disclosed |
| CN-118055961-A | Method for producing epoxy resin, epoxy resin composition, cured product, and electric/electronic component | 三菱化学株式会社 | 2024-05-17 | — | — | CN | disclosed |
| WO-2024101359-A1 | CURABLE COMPOSITION FOR INKJET, LED MODULE AND METHOD FOR PRODUCING LED MODULE | 積水化学工業株式会社 | 2024-05-16 | — | — | WO | disclosed |
| WO-2024080336-A1 | CURABLE COMPOSITION FOR INKJET USE AND FOR AIR CAVITY FORMATION, AND ELECTRONIC COMPONENT | 積水化学工業株式会社 | 2024-04-18 | — | — | WO | disclosed |
| WO-2024080335-A1 | ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT | 積水化学工業株式会社 | 2024-04-18 | — | — | WO | disclosed |
| US-5126188-A | Curable epoxy resin blended with thermoplastic resin, filler and curing agent | TOYO TIRE & RUBBER COMPANY LIMITED (JP) | 1992-06-30 | — | — | US | disclosed |
| US-5124234-A | Protective coating for printed circuits | FUJI PHOTO FILM CO., LTD. (JP) | 1992-06-23 | — | — | US | disclosed |
| US-5116670-A | Composed of polybasic acid and polyhydric alcohol; ester bonded to one terminal; electronics | SHOWA DENKO K.K. (JP) | 1992-05-26 | — | — | US | disclosed |
| US-5025067-A | Low temperature fixing, offset resistance | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1991-06-18 | — | — | US | disclosed |
| EP-0420208-A2 | Allyl ester resin composition and laminated sheet using the same | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1991-04-03 | — | — | EP | disclosed |
| US-4957995-A | Low-viscosity epoxy resin, and fiber-reinforced composite material based on m-alkyl triglycidylaminophenols | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1990-09-18 | — | — | US | disclosed |
| US-4948700-A | PHOTOPOLYMERIZABLE COMPOSITION OF EPOXY NOVOLAKS, UNSATURATED ACIS, POLYBASIC ANHYDRIDES, UNSATURATED ETHYLENIC COMPOUNDS, EPOXY COMPONENTS; CURING, MASHING, PRINTED CIRCUITS | FUJI PHOTO FILM CO., LTD. (JP) | 1990-08-14 | — | — | US | disclosed |
| US-4900848-A | Low-viscosity epoxy resin, and fiber-reinforced composite material from triglycidyl m-aminophenols | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1990-02-13 | — | — | US | disclosed |
| EP-0317367-A2 | Epoxy resins and electrostatographic toner containing the same as binder | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1989-05-24 | — | — | EP | disclosed |
| EP-0217657-A2 | Low-viscosity epoxy resin, resin composition containing it, and fibre-reinforced composite material containing cured product of the composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1987-04-08 | — | — | EP | disclosed |