SCHEMBL3030690

SCHEMBL3030690

CC1CCC2=C(C(=O)OC2=O)C12C(=O)OC2=O

nearest known ligand 0.32

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 3/20 0.32
CYP3A4 P08684 3/20 0.32
MAPK1 P28482 3/20 0.32
HIF1A Q16665 2/20 0.32
LMNA P02545 2/20 0.32
CYP1A2 P05177 2/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
NPC1 O15118 2/20 0.32
RAB9A P51151 2/20 0.32
NFKB1 P19838 1/20 0.32
THPO P40225 1/20 0.32
PPM1B O75688 1/20 0.32
PTPN1 P18031 1/20 0.32
PPP1CC P36873 1/20 0.32
TFPI2 P48307 1/20 0.32
PPP5C P53041 1/20 0.32
PPP2CA P67775 1/20 0.32
PPP1CA P62136 1/20 0.32
KDM4E B2RXH2 1/20 0.32
GMNN O75496 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL233456 0.73
SCHEMBL9307153 0.62 CRBN (0.34) SMN1; SMN2TSHR
SCHEMBL8618030 0.62 IDO1 (0.33) TP53CYP3A4MAPK1HIF1ALMNA
SCHEMBL346371 0.62 CRBN (0.34) SMN1; SMN2TSHR
SCHEMBL8619667 0.62 CA1 (0.37) KMT2A
SCHEMBL11757288 0.61
SCHEMBL10439640 0.59 CA1 (0.30)
SCHEMBL11549977 0.59 CA1 (0.48) SMN1; SMN2
SCHEMBL8621451 0.59 POLB (0.34) TP53MAPK1HIF1ALMNAKDM4E
SCHEMBL8620334 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9102786-B2 Epoxy resin composition, cured object obtained therefrom, and light-emitting diode MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-08-11 US disclosed
US-20100193831-A1 EPOXY RESIN COMPOSITION, CURED OBJECT OBTAINED THEREFROM, AND LIGHT-EMITTING DIODE MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) 2010-08-05 US disclosed