Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 13/20 | 0.76 |
| ▸ | ESR2 | Q92731 | 12/20 | 0.76 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.76 |
| ▸ | HPGD | P15428 | 2/20 | 0.76 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.76 |
| ▸ | AR | P10275 | 1/20 | 0.76 |
| ▸ | TSHR | P16473 | 1/20 | 0.76 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.76 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.76 |
| ▸ | HTR6 | P50406 | 1/20 | 0.76 |
| ▸ | ESRRG | P62508 | 1/20 | 0.76 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.76 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.64 |
| ▸ | LMNA | P02545 | 2/20 | 0.54 |
| ▸ | TYR | P14679 | 2/20 | 0.54 |
| ▸ | SHBG | P04278 | 1/20 | 0.45 |
| ▸ | CA12 | O43570 | 2/20 | 0.42 |
| ▸ | CA2 | P00918 | 2/20 | 0.42 |
| ▸ | CA3 | P07451 | 2/20 | 0.42 |
| ▸ | CA9 | Q16790 | 2/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bisphenol A SCHEMBL486701 | 1.00 | ESR1 (0.76) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| Cyanate SCHEMBL2410070 | 0.92 | ESR1 (0.80) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| Bisphenol A SCHEMBL11798493 | 0.90 | ESR1 (0.94) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| SCHEMBL27996 | 0.87 | ESR1 (1.00) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| Bisphenol A SCHEMBL8058731 | 0.87 | ESR1 (1.00) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| Bisphenol A SCHEMBL9774987 | 0.87 | ESR1 (1.00) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| Bisphenol A SCHEMBL278218 | 0.87 | ESR1 (1.00) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| SCHEMBL15868669 | 0.87 | ESR1 (1.00) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| Bisphenol A SCHEMBL3170263 | 0.87 | ESR1 (1.00) | ESR1ESR2CYP3A4HPGDHSD17B10 | |
| Bisphenol A SCHEMBL15062 | 0.87 | ESR1 (1.00) | ESR1ESR2CYP3A4HPGDHSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 366 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122011728-A | Bulletproof material based on high-molecular composite material and preparation method thereof | 中能智慧能源发展(江苏)有限公司 | 2026-05-12 | — | — | CN | claimed |
| CN-122010815-A | Fluorine-containing bismaleimide alkali-soluble resin, preparation method thereof, photoresist and application | 西安思摩威新材料有限公司 | 2026-05-12 | — | — | CN | claimed |
| CN-119391325-B | Modified adhesive layer for FPC (Flexible printed Circuit) and preparation method thereof | 苏州科谷纳新材料科技有限公司 | 2025-05-30 | — | — | CN | claimed |
| CN-120040750-A | Preparation method of high-temperature-resistant engineering plastic amino-terminated polyaryl ether nitrile toughened BT resin | 四川金象赛瑞化工股份有限公司 | 2025-05-27 | — | — | CN | claimed |
| CN-120005399-A | High-temperature-resistant flame-retardant BT resin for copper-clad plate and preparation method thereof | 江苏耀鸿电子有限公司 | 2025-05-16 | — | — | CN | claimed |
| US-20250136761-A1 | MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION AND APPLICATION OF RESIN COMPOSITION | SHENGYI TECHNOLOGY (SUZHOU) CO., LTD (CN) | 2025-05-01 | — | — | US | claimed |
| CN-119823573-A | Preparation method of modified cyanate resin | 中国航空工业集团公司济南特种结构研究所 | 2025-04-15 | — | — | CN | claimed |
| CN-119708478-A | High-temperature-resistant low-release cyanate resin, and preparation method and application thereof | 上海复合材料科技有限公司 | 2025-03-28 | — | — | CN | claimed |
| CN-119142006-B | Preparation method of high-frequency high-speed BT resin-based copper-clad plate | 江苏耀鸿电子有限公司 | 2025-03-25 | — | — | CN | claimed |
| CN-119639229-A | Thermosetting resin composition and application thereof | 睿龙材料科技(江苏)有限公司 | 2025-03-18 | — | — | CN | claimed |
| CN-110964320-B | Flame-retardant maleimide composition and preparation method of copper-clad plate thereof | 艾蒙特成都新材料科技有限公司 | 2022-06-07 | — | — | CN | claimed |
| CN-112280370-B | Cyanate ester ink for 3D printing and preparation method and application thereof | 中国科学院兰州化学物理研究所 | 2022-05-17 | — | — | CN | claimed |
| CN-110804308-B | Polyphenyl ether epoxy resin composition, preparation method and application | 珠海宏昌电子材料有限公司 | 2022-05-13 | — | — | CN | claimed |
| CN-114409861-A | Low-dielectric ablation-resistant benzoxazine resin and preparation method thereof | 北京玻钢院复合材料有限公司 | 2022-04-29 | — | — | CN | claimed |
| CN-114367762-A | Solder alloy powder, low dielectric loss high reliability soldering paste and preparation method thereof | 中山翰华锡业有限公司 | 2022-04-19 | — | — | CN | claimed |
| CN-114367761-A | Halogen-free lead-free soldering paste with low residues after soldering and preparation method thereof | 中山翰华锡业有限公司 | 2022-04-19 | — | — | CN | claimed |
| CN-114316589-A | High-frequency resin composition, prepreg, laminate, interlayer insulating film, high-frequency circuit board, and electronic device | 苏州生益科技有限公司 | 2022-04-12 | — | — | CN | claimed |
| CN-111590235-B | Low-dielectric-loss high-reliability soldering paste and preparation method thereof | 中山翰华锡业有限公司 | 2022-04-01 | — | — | CN | claimed |
| CN-111500248-B | Low-curing-temperature heat-resistant cyanate ester adhesive and preparation method thereof | 遂宁立讯精密工业有限公司 | 2022-03-22 | — | — | CN | claimed |
| JP-4782693-B2 | — | — | 2011-09-28 | — | — | JP | claimed |