Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 8/20 | 0.80 |
| ▸ | ESR2 | Q92731 | 8/20 | 0.80 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.80 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.80 |
| ▸ | AR | P10275 | 1/20 | 0.64 |
| ▸ | HPGD | P15428 | 1/20 | 0.64 |
| ▸ | TSHR | P16473 | 1/20 | 0.64 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.64 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.64 |
| ▸ | HTR6 | P50406 | 1/20 | 0.64 |
| ▸ | ESRRG | P62508 | 1/20 | 0.64 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.64 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.64 |
| ▸ | LMNA | P02545 | 1/20 | 0.46 |
| ▸ | TYR | P14679 | 1/20 | 0.46 |
| ▸ | CNR1 | P21554 | 4/20 | 0.42 |
| ▸ | CNR2 | P34972 | 4/20 | 0.42 |
| ▸ | NR3C2 | P08235 | 3/20 | 0.41 |
| ▸ | SHBG | P04278 | 1/20 | 0.39 |
| ▸ | CA12 | O43570 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bisphenol A SCHEMBL2335786 | 0.92 | ESR1 (0.76) | ESR1ESR2CYP3A4ALDH1A1AR | |
| Bisphenol A SCHEMBL486701 | 0.92 | ESR1 (0.76) | ESR1ESR2CYP3A4ALDH1A1AR | |
| Cyanate SCHEMBL29834243 | 0.89 | ESR1 (0.60) | ESR1ESR2CYP3A4ALDH1A1AR | |
| SCHEMBL9353524 | 0.89 | ESR1 (1.00) | ESR1ESR2CYP3A4ALDH1A1AR | |
| SCHEMBL51117 | 0.89 | ESR1 (1.00) | ESR1ESR2CYP3A4ALDH1A1AR | |
| SCHEMBL4310025 | 0.89 | ESR1 (1.00) | ESR1ESR2CYP3A4ALDH1A1AR | |
| SCHEMBL16568667 | 0.87 | ESR1 (0.95) | ESR1ESR2CYP3A4ALDH1A1AR | |
| Barium SCHEMBL30124542 | 0.87 | ESR1 (0.95) | ESR1ESR2CYP3A4ALDH1A1AR | |
| Hydrogen Sulfide SCHEMBL5204816 | 0.87 | ESR1 (0.95) | ESR1ESR2CYP3A4ALDH1A1AR | |
| Phenol SCHEMBL5691556 | 0.87 | ESR1 (0.95) | ESR1ESR2CYP3A4ALDH1A1AR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1979397-B1 | SHAPE MEMORY CYANATE ESTER COPOLYMERS | CORNERSTONE RES GROUP INC (US) | 2011-09-07 | — | — | EP | claimed |
| CN-119775953-A | Adhesive composition, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2025-04-08 | — | — | CN | disclosed |
| CN-119307222-A | Adhesive composition, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2025-01-14 | — | — | CN | disclosed |
| CN-118955914-A | Modified cyanate resin with latent thermoplastic catalyst, preparation method and application thereof | 中国科学院宁波材料技术与工程研究所 | 2024-11-15 | — | — | CN | disclosed |
| CN-112980385-B | Adhesive composition, related articles of adhesive composition, and methods of making the same | 荒川化学工业株式会社 | 2024-06-18 | — | — | CN | disclosed |
| US-20240191030-A1 | RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2024-06-13 | — | — | US | disclosed |
| CN-117700990-A | Resin composition, adhesive, coating agent, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2024-03-15 | — | — | CN | disclosed |
| US-20240043637-A1 | THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2024-02-08 | — | — | US | disclosed |
| CN-112011308-B | Composition, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2023-05-30 | — | — | CN | disclosed |
| WO-2022264984-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| CN-101595553-A | Method for coating semiconductor wafer with salient points | HENKEL AG & CO KGAA (DE) | 2009-12-02 | — | — | CN | disclosed |
| CN-101589465-A | Board on chip package and process for making same | HENKEL AG & CO KGAA (DE) | 2009-11-25 | — | — | CN | disclosed |
| CN-101535379-A | Composition with heat-treated silica filler for enhanced performance | NAT STARCH CHEM INVEST (US) | 2009-09-16 | — | — | CN | disclosed |
| CN-101511918-A | Method for changing rheological properties of filled resin systems using cavitation | NAT STARCH CHEM INVEST (US) | 2009-08-19 | — | — | CN | disclosed |
| CN-101033295-A | Curable materials containing siloxane | NAT STARCH CHEM INVEST (US) | 2007-09-12 | — | — | CN | disclosed |
| CN-1970668-A | Metal salts of quinolinols and quinolinol derivatives as adhesion and conductivity promoters in die attach adhesives | NAT STARCH CHEM INVEST (US) | 2007-05-30 | — | — | CN | disclosed |
| CN-1919953-A | Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives | NAT STARCH CHEM INVEST (US) | 2007-02-28 | — | — | CN | disclosed |
| CN-1919525-A | Quinolinols as fluxing and accelerating agents for underfill compositions | NAT STARCH CHEM INVEST (US) | 2007-02-28 | — | — | CN | disclosed |
| CN-1880008-A | Fluxing compositions | NAT STARCH CHEM INVEST (US) | 2006-12-20 | — | — | CN | disclosed |
| CN-1676564-A | Method to improve high temperature cohesive strength with adhesive having multi-phase system | NAT STARCH CHEM INVEST (US) | 2005-10-05 | — | — | CN | disclosed |