SCHEMBL2336034

SCHEMBL2336034

CCCCCCCCCCCCCCCCCC(=O)F

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 5/20 0.62
CES1 P23141 5/20 0.62
GPR84 Q9NQS5 7/20 0.59
PPARG P37231 7/20 0.59
PPARD Q03181 7/20 0.59
PPARA Q07869 7/20 0.59
HDAC11 Q96DB2 5/20 0.59
TSHR P16473 5/20 0.59
PTPN1 P18031 3/20 0.59
ALDH1A1 P00352 3/20 0.59
TLR2 O60603 2/20 0.59
TDP1 Q9NUW8 2/20 0.59
FABP4 P15090 2/20 0.59
SLC22A6 Q4U2R8 1/20 0.59
SLC22A8 Q8TCC7 1/20 0.59
MEN1 O00255 1/20 0.59
ESR1 P03372 1/20 0.59
ALOX15 P16050 1/20 0.59
PDE4A P27815 1/20 0.59
KMT2A Q03164 1/20 0.59

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27564098 1.00 CES2 (0.62) CES2CES1GPR84PPARGPPARD
SCHEMBL25947206 1.00 CES2 (0.62) CES2CES1GPR84PPARGPPARD
SCHEMBL27528985 1.00 CES2 (0.62) CES2CES1GPR84PPARGPPARD
SCHEMBL17742313 1.00 CES2 (0.62) CES2CES1GPR84PPARGPPARD
SCHEMBL5701258 1.00 CES2 (0.62) CES2CES1GPR84PPARGPPARD
SCHEMBL2326471 1.00 CES2 (0.62) CES2CES1GPR84PPARGPPARD
SCHEMBL7749073 1.00 CES2 (0.62) CES2CES1GPR84PPARGPPARD
SCHEMBL30991864 1.00 CES2 (0.62) CES2CES1GPR84PPARGPPARD
SCHEMBL8590718 1.00 CES2 (0.62) CES2CES1GPR84PPARGPPARD
SCHEMBL8344152 1.00

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109971376-B Dicing die bonding film 日东电工株式会社 2022-05-10 CN disclosed
CN-106232575-A Carboxylic ester/urethane compound having polymerizable functional group and fluorine atom group, and method for producing same 优迈特株式会社 2016-12-14 CN disclosed
US-8003038-B2 Process for producing resin molded article HITACHI MAXELL, LTD. (JP) 2011-08-23 US disclosed
US-20100025880-A1 PROCESS FOR PRODUCING RESIN MOLDED ARTICLE HITACHI MAXELL, LTD. (JP) 2010-02-04 US disclosed
US-20050185570-A1 Protective tape used for optical member, optical film with protective tape, and image viewing display with protective tape NITTO DENKO CORPORATION (JP) 2005-08-25 US disclosed
US-6899949-B2 Protective tape used for optical member, treated layer forming agent used for protective tape used for optical member, optical film with protective tape and image viewing display with protective tape NITTO DENKO CORPORATION (JP) 2005-05-31 US disclosed
US-20030219592-A1 Protective tape used for optical member, treated layer forming agent used for protective tape used for optical member, optical film with protective tape and image viewing display with protective tape NITTO DENKO CORPROATION (JP) 2003-11-27 US disclosed
EP-0261574-B1 CURABLE CROSS-LINKED POLYPHENYLENE ETHER INTERPENETRATING POLYMER NETWORK COMPOSITIONS AND PROCESS GENERAL ELECTRIC COMPANY (US) 1991-11-13 EP disclosed
EP-0264623-B1 CURABLE LINEAR POLYPHENYLENE ETHER INTERPENETRATING POLYMER NETWORK COMPOSITIONS AND PROCESS GENERAL ELECTRIC COMPANY (US) 1991-11-06 EP disclosed
EP-0264623-A2 Curable linear polyphenylene ether interpenetrating polymer network compositions and process GENERAL ELECTRIC COMPANY (US) 1988-04-27 EP disclosed
EP-0261574-A2 Curable cross-linked polyphenylene ether interpenetrating polymer network compositions and process GENERAL ELECTRIC COMPANY (US) 1988-03-30 EP disclosed