2-Ethylhexanoic Acid

2-Ethylhexanoic Acid

SCHEMBL2338859

CCCCC(CC)C(=O)[O-].CC[N+](C)(C)C

nearest known ligand 0.78

Full drug profile on Sugi Atlas →

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CA2 P00918 10/20 0.78
MAPK1 P28482 2/20 0.53
CA1 P00915 7/20 0.52
CYP3A4 P08684 2/20 0.48
TSHR P16473 2/20 0.48
NFKB1 P19838 2/20 0.48
NPSR1 Q6W5P4 2/20 0.48
CA7 P43166 1/20 0.40
CA14 Q9ULX7 1/20 0.40
SLC1A3 P43003 1/20 0.38
SLC1A2 P43004 1/20 0.38
SLC1A1 P43005 1/20 0.38
USP2 O75604 1/20 0.37
MEN1 O00255 1/20 0.36
ALDH1A1 P00352 1/20 0.36
MAPT P10636 1/20 0.36
KMT2A Q03164 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
2-Ethylhexanoic Acid SCHEMBL556997 0.92 CA2 (0.84) CA2MAPK1CA1CYP3A4TSHR
2-Ethylhexanoic Acid SCHEMBL557760 0.91 CA2 (0.75) CA2MAPK1CA1CYP3A4TSHR
2-Ethylhexanoic Acid SCHEMBL3476744 0.89 CA2 (0.78) CA2MAPK1CA1CYP3A4TSHR
2-Ethylhexanoic Acid SCHEMBL305226 0.88 CA2 (0.91) CA2MAPK1CA1CYP3A4TSHR
2-Ethylhexanoic Acid SCHEMBL20582677 0.88 CA2 (0.91) CA2MAPK1CA1CYP3A4TSHR
2-Ethylhexanoic Acid SCHEMBL23802667 0.88 CA2 (0.91) CA2MAPK1CA1CYP3A4TSHR
2-Ethylhexanoic Acid SCHEMBL8577270 0.88 CA2 (0.91) CA2MAPK1CA1CYP3A4TSHR
2-Ethylhexanoic Acid SCHEMBL21569275 0.88 CA2 (0.91) CA2MAPK1CA1CYP3A4TSHR
2-Ethylhexanoic Acid SCHEMBL714268 0.88 CA2 (0.91) CA2MAPK1CA1CYP3A4TSHR
2-Ethylhexanoic Acid SCHEMBL170609 0.88 CA2 (0.91) CA2MAPK1CA1CYP3A4TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023188952-A1 HEAT-DISSIPATING RUBBER COMPOSITION, THERMALLY CONDUCTIVE RUBBER COMPOSITION, HEAT-DISSIPATING MATERIAL, AND CURED PRODUCT 日清紡ホールディングス株式会社 2023-10-05 WO disclosed
US-11225548-B2 Resin composition, heat-conductive flexible sheet using same, and heat dissipation structure NISSHINBO HOLDINGS INC. (JP) 2022-01-18 US disclosed
EP-3514188-B1 RESIN COMPOSITION, HEAT-CONDUCTIVE FLEXIBLE SHEET USING SAME, AND HEAT DISSIPATION STRUCTURE NISSHINBO HOLDINGS INC (JP) 2021-08-18 EP disclosed
CN-109715690-B Resin composition, and heat conductive soft sheet and heat dissipation structure using same 日清纺控股株式会社 2021-06-25 CN disclosed
US-20200369823-A1 RESIN COMPOSITION, HEAT-CONDUCTIVE FLEXIBLE SHEET USING SAME, AND HEAT DISSIPATION STRUCTURE NISSHINBO HOLDINGS INC. (JP) 2020-11-26 US disclosed
EP-3514188-A1 RESIN COMPOSITION, HEAT-CONDUCTIVE FLEXIBLE SHEET USING SAME, AND HEAT DISSIPATION STRUCTURE Nisshinbo Holdings Inc. (JP) 2019-07-24 EP disclosed
EP-2358792-A1 METHOD FOR PRODUCING ORGANOSILICON COMPOUNDS HAVING AMINO GROUPS Wacker Chemie AG (DE) 2011-08-24 EP disclosed
WO-2010069820-A1 METHOD FOR PRODUCING ORGANOSILICON COMPOUNDS HAVING AMINO GROUPS WACKER CHEMIE AG (DE) 2010-06-24 WO disclosed