SCHEMBL234748

SCHEMBL234748

O=C1N(COC2CCCCC2)C2C(N1COC1CCCCC1)N(COC1CCCCC1)C(=O)N2COC1CCCCC1

nearest known ligand 0.38

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 1/20 0.38
TSHR P16473 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.31
NAAA Q02083 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL236795 0.98 NPC1 (0.35) NPC1TSHRL3MBTL1
SCHEMBL18804149 0.89 HCRTR2 (0.33) NPC1TSHR
SCHEMBL11374005 0.85 NPC1 (0.36) NPC1NAAA
SCHEMBL18561096 0.81 GAA (0.40)
SCHEMBL18561098 0.81 L3MBTL1 (0.33) TSHRL3MBTL1
SCHEMBL11369320 0.80 NPC1 (0.33) NPC1NAAA
SCHEMBL18804143 0.77 HCRTR2 (0.36)
SCHEMBL725248 0.71 TDP1 (0.46) NPC1
SCHEMBL18179822 0.69 GAA (0.33) L3MBTL1
SCHEMBL723474 0.68 TDP1 (0.47)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12242193-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2025-03-04 US disclosed
US-20230418161-A1 COATING COMPOSITIONS FOR USE WITH AN OVERCOATED PHOTORESIST ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-12-28 US disclosed
US-11822248-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-11-21 US disclosed
US-11822248-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-11-21 US disclosed
US-11822248-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-11-21 US disclosed
US-20230288809-A1 COMPOSITION FOR RESIST UNDERLAYER AND PATTERN FORMATION METHOD USING SAME SAMSUNG SDI CO., LTD. (KR) 2023-09-14 US disclosed
US-20230288809-A1 COMPOSITION FOR RESIST UNDERLAYER AND PATTERN FORMATION METHOD USING SAME SAMSUNG SDI CO., LTD. (KR) 2023-09-14 US disclosed
US-10788751-B2 Coating composition for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2020-09-29 US disclosed
US-10444627-B2 Pattern formation method, active light-sensitive or radiation-sensitive resin composition, resist film, production method for electronic device using same, and electronic device FUJIFILM CORPORATION (JP) 2019-10-15 US disclosed
US-20180120706-A1 PATTERN FORMING METHOD, LAMINATE, AND RESIST COMPOSITION FOR ORGANIC SOLVENT DEVELOPMENT FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20120028196-A1 METHOD OF FORMING PATTERN AND ORGANIC PROCESSING LIQUID FOR USE IN THE METHOD FUJIFILM CORPORATION (JP) 2012-02-02 US disclosed
US-20120003591-A1 METHOD OF FORMING PATTERN AND DEVELOPER FOR USE IN THE METHOD FUJIFILM CORPORATION (JP) 2012-01-05 US disclosed
US-20110287234-A1 NEGATIVE RESIST PATTERN FORMING METHOD, DEVELOPER AND NEGATIVE CHEMICAL-AMPLIFICATION RESIST COMPOSITION USED THEREFOR, AND RESIST PATTERN FUJIFILM CORPORATION (JP) 2011-11-24 US disclosed
EP-2384458-A1 NEGATIVE RESIST PATTERN FORMING METHOD, DEVELOPER AND NEGATIVE CHEMICAL-AMPLIFICATION RESIST COMPOSITION USED THEREFOR, AND RESIST PATTERN FUJIFILM Corporation (JP) 2011-11-09 EP disclosed
WO-2011132764-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2011-10-27 WO disclosed
WO-2011102546-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2011-08-25 WO disclosed
WO-2011087144-A1 PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2011-07-21 WO disclosed
WO-2011083872-A1 PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2011-07-14 WO disclosed
WO-2011043481-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2011-04-14 WO disclosed
WO-2010087516-A1 NEGATIVE RESIST PATTERN FORMING METHOD, DEVELOPER AND NEGATIVE CHEMICAL-AMPLIFICATION RESIST COMPOSITION USED THEREFOR, AND RESIST PATTERN FUJIFILM CORPORATION (JP) 2010-08-05 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10788751-B2 Coating composition for use with an overcoated photoresist COL14A1, COPE, COL2A1 NPC1 3305/4885TSHR 4343/4885L3MBTL1 4233/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.