SCHEMBL23501533

SCHEMBL23501533

Nc1ccc(Cc2cc(N)ccc2N)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.56
ALDH1A1 P00352 1/20 0.56
TSHR P16473 1/20 0.56
TDP1 Q9NUW8 1/20 0.56
GFER P55789 1/20 0.44
LOXL2 Q9Y4K0 1/20 0.42
CYP19A1 P11511 2/20 0.42
HTR6 P50406 1/20 0.42
CYP17A1 P05093 1/20 0.41
CYP11B1 P15538 1/20 0.41
CYP11B2 P19099 1/20 0.41
MEN1 O00255 2/20 0.40
MAPT P10636 2/20 0.40
KMT2A Q03164 2/20 0.40
KDM4E B2RXH2 1/20 0.40
POLB P06746 1/20 0.40
GAA P10253 1/20 0.40
RAB9A P51151 1/20 0.40
MAOA P21397 2/20 0.38
MAOB P27338 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL692514 0.89 ALDH1A1 (0.61) CYP3A4ALDH1A1TSHRTDP1GFER
SCHEMBL28954246 0.88 ALDH1A1 (0.43) CYP3A4ALDH1A1TSHRTDP1LOXL2
SCHEMBL12110703 0.88 ACHE (0.44) CYP3A4ALDH1A1TSHRTDP1POLB
SCHEMBL12110839 0.88 ALDH1A1 (0.43) CYP3A4ALDH1A1TSHRTDP1MEN1
SCHEMBL12110844 0.88 ESR1 (0.48) CYP3A4ALDH1A1TSHRTDP1MEN1
SCHEMBL6839208 0.87 HTR2A (0.48) CYP3A4ALDH1A1TSHRTDP1CYP19A1
SCHEMBL5253257 0.85 MAPT (0.46) CYP3A4ALDH1A1TSHRTDP1GFER
SCHEMBL12110838 0.85 GFER (0.40) CYP3A4ALDH1A1TSHRTDP1GFER
SCHEMBL20869794 0.84 ALDH1A1 (0.59) CYP3A4ALDH1A1TSHRTDP1GFER
SCHEMBL27902741 0.84 CYP3A4 (0.48) CYP3A4ALDH1A1TSHRTDP1GFER

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113784999-A Fluorine-containing epoxy resin for electrical material and method for producing same 大金工业株式会社 2021-12-10 CN disclosed
WO-2021117486-A1 COMPOSITION, CURABLE COMPOSITION, AND CURED PRODUCT ダイキン工業株式会社 2021-06-17 WO disclosed