⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19983357 | 0.87 | CA12 (0.31) | — | |
| SCHEMBL442777 | 0.82 | ALOX15 (0.31) | — | |
| SCHEMBL16652635 | 0.80 | ALOX15 (0.30) | — | |
| SCHEMBL2565127 | 0.78 | CA12 (0.32) | — | |
| SCHEMBL10411836 | 0.77 | — | — | |
| SCHEMBL16862752 | 0.77 | ALOX15 (0.30) | — | |
| SCHEMBL31689754 | 0.76 | CHRM2 (0.33) | — | |
| SCHEMBL31142799 | 0.76 | LMNA (0.30) | — | |
| SCHEMBL16862753 | 0.76 | LMNA (0.30) | — | |
| SCHEMBL17133250 | 0.76 | CYP1A2 (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0637902-B1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC (US) | 1999-03-31 | — | — | EP | claimed |
| EP-0637902-A1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC. (US) | 1995-02-08 | — | — | EP | claimed |
| US-8597508-B2 | Sol-gel monolithic column with optical window and method of making | UNIVERSITY OF SOUTH FLORIDA (US) | 2013-12-03 | — | — | US | disclosed |
| EP-1037511-B1 | Surface treatment of copper to prevent microcracking in flexible circuits | JX NIPPON MINING & METALS CORP (JP) | 2012-07-18 | — | — | EP | disclosed |
| US-20120000850-A1 | SOL-GEL MONOLITHIC COLUMN WITH OPTICAL WINDOW AND METHOD OF MAKING | UNIVERSITY OF SOUTH FLORIDA (US) | 2012-01-05 | — | — | US | disclosed |
| US-7947174-B2 | Sol-gel monolithic column with optical window and method of making | UNIVERSITY OF SOUTH FLORIDA (US) | 2011-05-24 | — | — | US | disclosed |
| US-7749607-B2 | Film derrived from a conductive sol-gel aqueous emulsion containing emulsifiers, organofunctional silanes, and conductive metals and/or metal oxides; mirror finish smooth surface; powder coating for heat sensitive and/or flammable objects | NORTHERN ILLINOIS UNIVERSITY (US) | 2010-07-06 | — | — | US | disclosed |
| US-20100112208-A1 | Titania-Based Coating for Capillary Microextraction | MALIK ABDUL | 2010-05-06 | — | — | US | disclosed |
| US-7622191-B2 | also called in tube solid-phase microextraction; inorganic-organic hybrid coating of titania-polydimethylsiloxane; preconcentrates sample for high pressure liquid chromatography analysis; pH stability, retains extraction performance even after NaOH treatment | UNIVERSITY OF SOUTH FLORIDA (US) | 2009-11-24 | — | — | US | disclosed |
| US-20090189129-A1 | Film derrived from a conductive sol-gel aqueous emulsion containing emulsifiers, organofunctional silanes, and conductive metals and/or metal oxides; mirror finish smooth surface; powder coating for heat sensitive and/or flammable objects | NORTHERN ILLINOIS UNIVERSITY | 2009-07-30 | — | — | US | disclosed |
| US-7534831-B2 | Mixtures of water, emulsifiers, organic silicon compounds, electroconductive metals/metal oxide particles and pH controllers, used to form films that improve electrical properties of wood fibers or plastics | NORTHERN ILLINOIS UNIVERSITY (US) | 2009-05-19 | — | — | US | disclosed |
| EP-1037511-A2 | Surface treatment of copper to prevent microcracking in flexible circuits | GA-TEK Inc. (US) | 2000-09-20 | — | — | EP | disclosed |
| US-6086743-A | Adhesion enhancement for metal foil | GOULD ELECTRONICS, INC. (US) | 2000-07-11 | — | — | US | disclosed |
| EP-0974685-A1 | Metal foil with improved bonding to substrates and method for making said foil | Gould Electronics Inc. (US) | 2000-01-26 | — | — | EP | disclosed |
| US-5908542-A | CONTACTING A METAL FOIL WITH AN ACIDIC SOLUTION; PLACING THE METAL FOIL IN A NICKEL TREATMENT BATH AND APPLYING A CURRENT THROUGH THE NICKEL TREATMENT BATH, WHEREIN THE NICKEL TREATMENT BATH CONTAINS AT LEAST ABOUT TWO PLATING ZONES, | GOULD ELECTRONICS INC. (US) | 1999-06-01 | — | — | US | disclosed |
| EP-0637902-B1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC (US) | 1999-03-31 | — | — | EP | disclosed |
| US-5885436-A | Adhesion enhancement for metal foil | GOULD ELECTRONICS INC. (US) | 1999-03-23 | — | — | US | disclosed |
| EP-0896502-A1 | Method of treating metal foil for enhancing adhesion | Gould Electronics Inc. (US) | 1999-02-10 | — | — | EP | disclosed |
| US-5622782-A | USEFUL IN MANUFACTURE OF PRINTED CIRCUIT BOARDS | GOULD INC. (US) | 1997-04-22 | — | — | US | disclosed |
| EP-0637902-A1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC. (US) | 1995-02-08 | — | — | EP | disclosed |