Known targets — ChEMBL curated mechanism
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
The experimentally established mechanism targets of Phosphoric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphoric Acid SCHEMBL6909635 | 1.00 | — | — | |
| Phosphoric Acid SCHEMBL6906677 | 1.00 | — | — | |
| Phosphoric Acid SCHEMBL22157299 | 0.94 | — | — | |
| Phosphoric Acid SCHEMBL515878 | 0.94 | — | — | |
| Phosphoric Acid SCHEMBL21490248 | 0.94 | CA2 (0.50) | — | |
| Phosphoric Acid SCHEMBL5142731 | 0.94 | — | — | |
| Phosphoric Acid SCHEMBL466025 | 0.94 | CA2 (0.50) | — | |
| Phosphoric Acid SCHEMBL23326935 | 0.94 | CA2 (0.50) | — | |
| Phosphoric Acid SCHEMBL248574 | 0.94 | — | — | |
| Phosphoric Acid SCHEMBL5680875 | 0.94 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11518937-B2 | Etching solution and method for manufacturing semiconductor element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-12-06 | — | — | US | disclosed |
| US-20210198572-A1 | ETCHING SOLUTION AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-07-01 | — | — | US | disclosed |