SCHEMBL23595461

SCHEMBL23595461

O=C(OCCS(=O)(=O)O)C1C2CC3C1OC(=O)[C@H]3C2

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.31
KMT2A Q03164 2/20 0.31
MEN1 O00255 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24760010 1.00 POLB (0.31) POLBKMT2AMEN1
SCHEMBL15745524 1.00 POLB (0.31) POLBKMT2AMEN1
SCHEMBL10172833 0.93 POLB (0.31) POLBKMT2A
SCHEMBL18775848 0.92 KMT2A (0.33) POLBKMT2AMEN1
SCHEMBL24861534 0.92 KMT2A (0.33) POLBKMT2AMEN1
SCHEMBL12149990 0.82 ALDH1A1 (0.30) POLB
SCHEMBL18572476 0.81
SCHEMBL21731695 0.80 KMT2A (0.30) POLBKMT2A
SCHEMBL17281287 0.80 KMT2A (0.30) POLBKMT2A
SCHEMBL18634249 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11703756-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-18 US disclosed
US-20230041025-A1 NEGATIVE-WORKING PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIST FILM, PATTERN FORMATION METHOD, CURED FILM, CURED FILM PRODUCTION METHOD, AND ROLLED BODY TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-09 US disclosed
US-11181822-B2 2021-11-23 US disclosed
US-20210200088-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-07-01 US disclosed