SCHEMBL2360103

SCHEMBL2360103

c1ccc(C2(c3ccccc3)CCO2)cc1

nearest known ligand 0.45

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 2/20 0.41
OPRK1 P41145 1/20 0.41
OPRL1 P41146 1/20 0.41
TSHR P16473 1/20 0.40
PNMT P11086 1/20 0.39
MAOA P21397 1/20 0.39
MAOB P27338 1/20 0.39
TAAR1 Q96RJ0 1/20 0.39
MEN1 O00255 1/20 0.38
CYP2C9 P11712 1/20 0.38
KMT2A Q03164 1/20 0.38
CYP1A2 P05177 1/20 0.37
DPP4 P27487 1/20 0.37
HTR2A P28223 1/20 0.37
AKR1C1 Q04828 1/20 0.37
ICMT O60725 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1569110 0.88 DPP4 (0.38) OPRM1OPRK1OPRL1PNMTMAOA
SCHEMBL8666950 0.86 DPP4 (0.41) OPRM1DPP4AKR1C1
SCHEMBL7003423 0.84 SLC6A2 (0.41) OPRM1DPP4AKR1C1
SCHEMBL11625346 0.81 OPRM1 (0.53) OPRM1TSHRCYP2C9CYP1A2HTR2A
Trimethylammonium SCHEMBL14720309 0.81 OPRL1 (0.45) OPRM1OPRK1OPRL1
SCHEMBL8016354 0.80 ALDH1A1 (0.36) OPRM1OPRK1OPRL1TSHRPNMT
SCHEMBL11623666 0.78 OPRM1 (0.49) OPRM1OPRK1TSHRHTR2A
SCHEMBL7107590 0.78 TSHR (0.32) OPRM1OPRK1OPRL1TSHRICMT
SCHEMBL1322736 0.78 CHRM2 (0.46) OPRM1OPRK1OPRL1
SCHEMBL15684552 0.77 OPRM1 (0.39) OPRM1OPRK1OPRL1TSHRPNMT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117616055-A Polyethylene copolymers with broad short chain branching distribution 格雷斯公司 2024-02-27 CN disclosed
CN-107382719-B Preparation method of anhydride modified biphenyl oxetane acrylate prepolymer 武汉长盈鑫科技有限公司 2020-07-14 CN disclosed
US-9685597-B2 Curable composition for sealing optical semiconductor DAICEL CORPORATION (JP) 2017-06-20 US disclosed
US-20160126431-A1 CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR DAICEL CORPORATION (JP) 2016-05-05 US disclosed
EP-3006481-A1 CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR Daicel Corporation (JP) 2016-04-13 EP disclosed
WO-2011096552-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING STRUCTURAL BODY, AND LIQUID DISCHARGE HEAD CANON KABUSHIKI KAISHA (JP) 2011-08-11 WO disclosed