SCHEMBL2363645

SCHEMBL2363645

CCCCOc1cccc(P(c2cccc(OCCCC)c2)c2cccc(OCCCC)c2)c1

nearest known ligand 0.54

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.53
LTA4H P09960 2/20 0.52
TLR4 O00206 1/20 0.48
TLR2 O60603 1/20 0.48
CYP1A2 P05177 1/20 0.48
CYP19A1 P11511 1/20 0.48
CYP2C9 P11712 1/20 0.48
CYP2C19 P33261 1/20 0.48
KMT2A Q03164 1/20 0.47
THRB P10828 1/20 0.47
PLA2G4B P0C869 2/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
GPBAR1 Q8TDU6 1/20 0.46
CYSLTR2 Q9NS75 1/20 0.46
CYSLTR1 Q9Y271 1/20 0.46
SMPD1 P17405 3/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4397448 0.84 TSHR (0.63) TSHRLTA4HTLR4TLR2CYP1A2
SCHEMBL14769625 0.83 KCNA3 (0.56) TSHR
SCHEMBL15281150 0.83 KCNA3 (0.50)
SCHEMBL10881069 0.82 TP53 (0.57) TSHRLTA4HCYP1A2CYP2C19KMT2A
SCHEMBL15281130 0.81 KCNA3 (0.54) TSHR
SCHEMBL15281165 0.81 TDP1 (0.48) LTA4H
1-Butyloxy-3-Propoxybenzene SCHEMBL3390925 0.80 TSHR (0.59) TSHRLTA4HTLR4TLR2CYP1A2
SCHEMBL9487103 0.79 LTA4H (0.68) TSHRLTA4HTLR4TLR2CYP1A2
1-Butyloxy-3-Ethoxybenzene SCHEMBL3459049 0.79 MAPK1 (0.62) TSHRLTA4HTLR4TLR2CYP1A2
SCHEMBL197506 0.79 CYP19A1 (0.64) TSHRLTA4HTLR4TLR2CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8354359-B2 Heat-sensitive adhesive agent and heat-sensitive adhesive sheet RICOH COMPANY, LTD. (JP) 2013-01-15 US disclosed
EP-2014688-B1 Thermosensitive adhesive material RICOH CO LTD (JP) 2012-05-30 EP disclosed
EP-2062953-B1 Heat-sensitive adhesive material RICOH CO LTD (JP) 2011-08-17 EP disclosed
US-7993732-B2 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2011-08-09 US disclosed
EP-2062953-A1 Heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2009-05-27 EP disclosed
US-20090130441-A1 HEAT-SENSITIVE ADHESIVE MATERIAL RICOH COMPANY, LTD (JP) 2009-05-21 US disclosed
US-20090017299-A1 THERMOSENSITIVE ADHESIVE MATERIAL RICOH COMPANY, LTD (JP) 2009-01-15 US disclosed
EP-2014688-A1 Thermosensitive adhesive material Ricoh Company, Ltd. (JP) 2009-01-14 EP disclosed
US-20080176012-A1 Heat-sensitive adhesive agent and heat-sensitive adhesive sheet RICOH COMPANY, LTD. (JP) 2008-07-24 US disclosed
EP-1897925-A1 Heat-sensitive adhesive agent and heat-sensitive adhesive sheet Ricoh Company, Ltd. (JP) 2008-03-12 EP disclosed
US-20080026205-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material RICOH COMPANY, LTD. (JP) 2008-01-31 US disclosed
EP-1882726-A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material Ricoh Company, Ltd. (JP) 2008-01-30 EP disclosed