SCHEMBL23645871

SCHEMBL23645871

NC1(C(=O)O)C=CC(CC2=CCC(N)(C(=O)O)C=C2)=CC1

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
GRM4 Q14833 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4394628 0.77 GRM4 (0.33) GRM4
SCHEMBL11543971 0.76 HSD11B1 (0.40) GRM4
SCHEMBL2810793 0.76 GRM4 (0.33) GRM4
SCHEMBL15168738 0.76 GRM4 (0.33) GRM4
1,3-Propanediol SCHEMBL11863574 0.73
SCHEMBL30601952 0.69 TSHR (0.37)
SCHEMBL6125816 0.69 EPHX1 (0.33)
SCHEMBL28909025 0.63
SCHEMBL4276134 0.61 NSD2 (0.30)
SCHEMBL28863504 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12321097-B2 Method of removing photoresist, laminate, method of forming metallic pattern, polyimide resin and stripper ECHEM SOLUTIONS CORP. (TW) 2025-06-03 US disclosed
CN-113219796-B Removing method, laminated body, forming method and polyimide resin 新应材股份有限公司 2025-01-10 CN disclosed
CN-113219796-A Removing method, laminate, forming method, polyimide resin, and stripping liquid 新应材股份有限公司 2021-08-06 CN disclosed
US-20210223699-A1 METHOD OF REMOVING PHOTORESIST, LAMINATE, METHOD OF FORMING METALLIC PATTERN, POLYIMIDE RESIN AND STRIPPER ECHEM SOLUTIONS CORP. (TW) 2021-07-22 US disclosed