SCHEMBL23660581

SCHEMBL23660581

CC1(C)c2ccccc2-c2ccc(N(c3ccccc3)c3ccc4cc(B5OC(C)(C)C(C)(C)O5)ccc4c3)cc21

nearest known ligand 0.41

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
LPL P06858 8/20 0.41
LIPG Q9Y5X9 8/20 0.41
PDK2 Q15119 2/20 0.33
IRAK4 Q9NWZ3 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
CA9 Q16790 1/20 0.32
PRMT5 O14744 1/20 0.31
WDR77 Q9BQA1 1/20 0.31
P4HB P07237 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29508650 1.00 LPL (0.41) LPLLIPGPDK2IRAK4CA1
SCHEMBL15906970 0.93 LIPG (0.41) LPLLIPGPDK2CA1CA2
SCHEMBL15906987 0.92 LPL (0.51) LPLLIPGPDK2IRAK4CA1
SCHEMBL15906990 0.92 LPL (0.48) LPLLIPGIRAK4CA1CA2
SCHEMBL15803118 0.92 LIPG (0.46) LPLLIPGPDK2CA1CA2
SCHEMBL31576189 0.92 LIPG (0.46) LPLLIPGPDK2CA1CA2
SCHEMBL13878215 0.90 LIPG (0.39) LPLLIPGPDK2PRMT5WDR77
SCHEMBL18016693 0.90 LPL (0.44) LPLLIPGPDK2CA1CA2
SCHEMBL15170052 0.90 LPL (0.44) LPLLIPGPDK2CA1CA2
SCHEMBL10034243 0.90 LIPG (0.44) LPLLIPGPDK2CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111233676-B High-performance hole transport material and preparation and application thereof 华南理工大学 2022-03-29 CN disclosed
WO-2021143222-A1 HIGH-PERFORMANCE HOLE TRANSPORT MATERIAL, AND PREPARATION METHOD THEREFOR AND APPLICATION THEREOF 华南理工大学 2021-07-22 WO disclosed
CN-112920058-A High-refractive-index organic small molecule material and application thereof 华南理工大学 2021-06-08 CN disclosed
CN-111233676-A High-performance hole transport material and preparation and application thereof 华南理工大学 2020-06-05 CN disclosed