SCHEMBL2367663

SCHEMBL2367663

Brc1cc2cc3cc4sc(Br)cc4cc3cc2s1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2150129 0.94 HSP90AA1 (0.30) —
SCHEMBL17010911 0.82 — —
SCHEMBL18371542 0.77 — —
SCHEMBL15274415 0.77 CYP2A6 (0.37) —
SCHEMBL15897439 0.75 CYP2A6 (0.50) —
SCHEMBL15897757 0.75 PTPN2 (0.32) —
SCHEMBL15897770 0.75 CYP2A6 (0.50) —
SCHEMBL15897392 0.74 GPR35 (0.61) —
SCHEMBL4443306 0.74 S100A4 (0.32) —
SCHEMBL4436652 0.74 S100A4 (0.32) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2368892-B1 NOVEL COMPOUND, PROCESS FOR PRODUCING THE COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, AND ORGANIC SEMICONDUCTOR DEVICE UNIV HIROSHIMA (JP) 2014-12-03 — — EP disclosed
EP-2368892-B1 NOVEL COMPOUND, PROCESS FOR PRODUCING THE COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, AND ORGANIC SEMICONDUCTOR DEVICE UNIV HIROSHIMA (JP) 2014-12-03 — — EP disclosed
US-8816100-B2 Compound, method of producing the compound, organic semiconductor material and organic semiconductor device HIROSHIMA UNIVERSITY (JP) 2014-08-26 — — US disclosed
US-8816100-B2 Compound, method of producing the compound, organic semiconductor material and organic semiconductor device HIROSHIMA UNIVERSITY (JP) 2014-08-26 — — US disclosed
US-8816100-B2 Compound, method of producing the compound, organic semiconductor material and organic semiconductor device HIROSHIMA UNIVERSITY (JP) 2014-08-26 — — US disclosed
US-20140051865-A1 DESCRIPTION NOVEL COMPUND, METHOD OF PRODUCING THE COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL AND ORGANIC SEMICONDUCTOR DEVICE HIROSHIMA UNIVERSITY (JP) 2014-02-20 — — US disclosed
US-20140051865-A1 DESCRIPTION NOVEL COMPUND, METHOD OF PRODUCING THE COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL AND ORGANIC SEMICONDUCTOR DEVICE HIROSHIMA UNIVERSITY (JP) 2014-02-20 — — US disclosed
US-20140051865-A1 DESCRIPTION NOVEL COMPUND, METHOD OF PRODUCING THE COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL AND ORGANIC SEMICONDUCTOR DEVICE HIROSHIMA UNIVERSITY (JP) 2014-02-20 — — US disclosed
EP-2368892-A1 NOVEL COMPOUND, PROCESS FOR PRODUCING THE COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, AND ORGANIC SEMICONDUCTOR DEVICE Hiroshima University (JP) 2011-09-28 — — EP disclosed
US-20110224445-A1 Novel Compound, Method of Producing the Compound, Organic Semiconductor Material and Organic Semiconductor Device HIROSHIMA UNIVERSITY (JP) 2011-09-15 — — US disclosed
US-20110224445-A1 Novel Compound, Method of Producing the Compound, Organic Semiconductor Material and Organic Semiconductor Device HIROSHIMA UNIVERSITY (JP) 2011-09-15 — — US disclosed
US-20110224445-A1 Novel Compound, Method of Producing the Compound, Organic Semiconductor Material and Organic Semiconductor Device HIROSHIMA UNIVERSITY (JP) 2011-09-15 — — US disclosed
WO-2010058692-A1 NOVEL COMPOUND, PROCESS FOR PRODUCING THE COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, AND ORGANIC SEMICONDUCTOR DEVICE 国立大学法人広島大学 (JP) 2010-05-27 — — WO disclosed
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