SCHEMBL23709

SCHEMBL23709

[GeH4].[SiH4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL430914 1.00
SCHEMBL352680 1.00
SCHEMBL28669843 1.00
SCHEMBL428692 1.00
SCHEMBL427351 1.00
SCHEMBL17707724 1.00
SCHEMBL28793381 1.00
SCHEMBL3760803 1.00
SCHEMBL23673298 0.82
SCHEMBL21380724 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 213229 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260146329-A1 SEMICONDUCTOR PROCESSING SYSTEMS, CHEMICAL VAPOR DEPOSITION (CVD) REACTORS AND METHODS FOR DEPOSITING MATERIAL ON SEMICONDUCTOR SUBSTRATES WITH UNIFORM TEMPERATURE AND GAS FLOW ACROSS THE SUBSTRATE SURFACE TOKYO ELECTRON LIMITED (JP) 2026-05-28 US claimed
US-20260150266-A1 MEMORY DEVICE AND MANUFACTURING METHOD THEREOF SK Hynix Inc. (KR) 2026-05-28 US claimed
US-20260146326-A1 SEMICONDUCTOR PROCESSING SYSTEMS, CHEMICAL VAPOR DEPOSITION (CVD) REACTORS AND METHODS FOR DEPOSITING MATERIAL ON SEMICONDUCTOR SUBSTRATES WITH UNIFORM TEMPERATURE AND GAS FLOW ACROSS THE SUBSTRATE SURFACE TOKYO ELECTRON LIMITED (JP) 2026-05-28 US claimed
US-20260150582-A1 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME SK Hynix Inc. (KR) 2026-05-28 US claimed
US-20260150394-A1 TRANSMISSION GATE STRUCTURES TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2026-05-28 US claimed
US-20260150649-A1 GATE ALL AROUND BACKSIDE POWER RAIL FORMATION WITH MULTI-COLOR BACKSIDE DIELECTRIC ISOLATION SCHEME APPLIED MATERIALS, INC. (US) 2026-05-28 US claimed
US-20260150327-A1 SEMICONDUCTOR NANOSTRUCTURES AND METHODS OF FORMING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2026-05-28 US claimed
US-20260150592-A1 METHOD OF FORMING A SILICON ON INSULATOR SUBSTRATE SK Hynix Inc. (KR) 2026-05-28 US claimed
EP-4750246-A1 RESISTOR FOR III-V SEMICONDUCTOR DEVICE GlobalFoundries U.S. Inc. (US) 2026-05-27 EP claimed
EP-4750304-A1 METHOD OF FORMING A SILICON ON INSULATOR SUBSTRATE SK hynix Inc. (KR) 2026-05-27 EP claimed
US-4595644-A Smooth distribution concentration of nitrogen in direction of layer thickness CANON KABUSHIKI KAISHA (JP) 1986-06-17 US claimed
US-4572882-A LIGHT RECEIVING LAYER CONTAINING NITROGEN ATOMS CANON KABUSHIKI KAISHA (JP) 1986-02-25 US claimed
EP-0160433-A2 Thermoelectric generator using variable geometry with support pedestals of materials different from the basic thermoelectric semiconductor elements OMNIMAX ENERGY CORPORATION (US) 1985-11-06 EP claimed
EP-0154997-A2 A high resolution image sensor array using amorphous photo-diodes NEC CORPORATION (JP) 1985-09-18 EP claimed
EP-0146830-A2 Additive for metallurgical liquids, and method and device for the preparation thereof O.E.T.-METALCONSULT S.r.l. (IT) 1985-07-03 EP claimed
US-4495262-A SILICON CARBIDE AND SILICON-GERMANIUM LAYERS, BOTH HYDROGENATED AND-OR FLUORINATED KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) 1985-01-22 US claimed
US-4485121-A DECOMPOSING MIXED GAS TO FORM DOPE TOKYO INSTITUTE OF TECHNOLOGY (JP) 1984-11-27 US claimed
US-4357183-A Heteroepitaxy of germanium silicon on silicon utilizing alloying control MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 1982-11-02 US claimed
US-3985590-A PROCESS FOR FORMING HETEROEPITAXIAL STRUCTURE HARRIS CORPORATION (US) 1976-10-12 US claimed
US-3979271-A Deposition of solid semiconductor compositions and novel semiconductor materials WESTINGHOUSE ELECTRIC CORPORATION (US) 1976-09-07 US claimed