SCHEMBL428692

SCHEMBL428692

[GeH4].[GeH4].[SiH4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL430914 1.00
SCHEMBL23709 1.00
SCHEMBL352680 1.00
SCHEMBL28669843 1.00
SCHEMBL427351 1.00
SCHEMBL17707724 1.00
SCHEMBL28793381 1.00
SCHEMBL3760803 1.00
SCHEMBL23673298 0.82
SCHEMBL21380724 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 132 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9070771-B2 Bulk finFET with controlled fin height and high-k liner INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2015-06-30 US claimed
US-20140353721-A1 BULK FINFET WITH CONTROLLED FIN HEIGHT AND HIGH-K LINER GLOBALFOUNDRIES U.S. INC. 2014-12-04 US claimed
US-20140061820-A1 BULK FINFET WITH CONTROLLED FIN HEIGHT AND HIGH-K LINER INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-03-06 US claimed
US-20260040607-A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME NANYA TECHNOLOGY CORP (TW) 2026-02-05 US disclosed
US-12432964-B2 Co-integrated gallium nitride (GaN) and complementary metal oxide semiconductor (CMOS) integrated circuit technology INTEL CORPORATION (US) 2025-09-30 US disclosed
US-20250185403-A1 IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE TAIWAN SEMICONDUCTOR MANFACTURING COMPANY, LTD. (TW) 2025-06-05 US disclosed
US-12255161-B2 Semiconductor device with composite conductive features and method for fabricating the same NANYA TECHNOLOGY CORPORATION (TW) 2025-03-18 US disclosed
US-12224297-B2 Method of forming an image sensor having stress releasing structure TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2025-02-11 US disclosed
US-12218087-B2 Semiconductor device with composite conductive features and method for fabricating the same NANYA TECHNOLOGY CORPORATION (TW) 2025-02-04 US disclosed
CN-113496974-B Semiconductor element and method for manufacturing the same 南亚科技股份有限公司 2024-10-18 CN disclosed
CN-113161352-B Semiconductor element and method for manufacturing the same 南亚科技股份有限公司 2024-10-18 CN disclosed
US-7915694-B2 Gate electrode having a capping layer INTEL CORPORATION (US) 2011-03-29 US disclosed
US-20090121297-A1 GATE ELECTRODE HAVING A CAPPING LAYER DEWEY GILBERT 2009-05-14 US disclosed
US-7332386-B2 Methods of fabricating fin field transistors SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-02-19 US disclosed
US-20070297967-A1 Hydride Compounds With Silicon And Germanium Core Atoms And Method Of Synthesizing Same ARIZONA BOARD OF REGENTS (US) 2007-12-27 US disclosed
US-20070108404-A1 METHOD OF SELECTIVELY DEPOSITING A THIN FILM MATERIAL AT A SEMICONDUCTOR INTERFACE APPLIED MATERIALS, INC. 2007-05-17 US disclosed
WO-2006031240-A1 HYDRIDE COMPOUNDS WITH SILICON AND GERMANIUM CORE ATOMS AND METHOD OF SYNTHESIZING SAME ARIZONA BOARD OF REGENTS (US) 2006-03-23 WO disclosed
US-20050269629-A1 Fin field effect transistors and methods of fabricating the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-12-08 US disclosed
US-6680504-B2 Method for constructing a metal oxide semiconductor field effect transistor TEXAS INSTRUMENTS INCORPORATED 2004-01-20 US disclosed
US-20020081792-A1 Method for constructing a metal oxide semiconductor field effect transistor TEXAS INSTRUMENTS INCORPORATED 2002-06-27 US disclosed