SCHEMBL2371099

SCHEMBL2371099

CNc1cc(NC)c(O)c(NC)c1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27601296 0.85 IDO1 (0.33)
SCHEMBL27752602 0.74 SELL (0.35)
SCHEMBL27481199 0.71 SIRT1 (0.32)
SCHEMBL27570525 0.71
SCHEMBL27500379 0.71 AOC1 (0.41)
SCHEMBL28205813 0.70 SELL (0.46)
SCHEMBL1130807 0.70 CA1 (0.40)
SCHEMBL28065744 0.70
Hydrochloric Acid SCHEMBL27531055 0.70 PRKCI (0.35)
SCHEMBL27855609 0.69 IDO1 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116836659-A Colloid and electronic equipment 华为技术有限公司 2023-10-03 CN claimed
EP-0991688-B1 TWO-COMPONENT COATING AGENT ON AN EPOXY RESIN BASE FOR CEMENT-BOUND BACKGROUNDS DEGUSSA CONSTRUCTION CHEM GMBH (CH) 2005-10-12 EP claimed
CN-113924629-B Conductive paste composition 京都一来电子化学股份有限公司 2024-04-09 CN disclosed
CN-116836659-A Colloid and electronic equipment 华为技术有限公司 2023-10-03 CN disclosed
CN-116525556-A Semiconductor device with a semiconductor device having a plurality of semiconductor chips 京瓷株式会社 2023-08-01 CN disclosed
EP-2981582-B1 SOLID BIOGENIC FILLERS IN ADHESIVES FOR SECURING TECHNOLOGY FISCHERWERKE GMBH & CO KG (DE) 2022-03-16 EP disclosed
CN-113924629-A Electroconductive paste composition 京都一来电子化学股份有限公司 2022-01-11 CN disclosed
CN-113785024-A Polymer composition for thin coatings SWIMC有限公司 2021-12-10 CN disclosed
CN-108699212-B Dual cure soft touch coating 阿科玛法国公司 2021-10-15 CN disclosed
CN-109563330-B Heat dissipating resin composition, cured product thereof, and method of using the same 3M创新有限公司 2021-06-08 CN disclosed
CN-112703207-A Aqueous resin emulsion, process for producing the same, and aqueous resin composition 昭和电工株式会社 2021-04-23 CN disclosed
WO-2014161637-A1 SOLID BIOGENIC FILLERS IN ADHESIVES FOR SECURING TECHNOLOGY FISCHERWERKE GMBH & CO. KG (DE) 2014-10-09 WO disclosed
WO-2014161638-A1 BIOGENIC FLUID NON-REACTIVE THINNING AGENTS IN SYNTHETIC RESIN ADHESIVES FISCHERWERKE GMBH & CO. KG (DE) 2014-10-09 WO disclosed
EP-2547634-A1 EPOXIDE-BASED FIXING MORTAR HAVING SILANE ADDITIONS Fischerwerke GmbH & Co. Kg (DE) 2013-01-23 EP disclosed
US-20130000839-A1 EPOXIDE-BASED FIXING MORTAR HAVING SILANE ADDITIONS FISCHERWERKE GMBH & CO. KG (DE) 2013-01-03 US disclosed
WO-2011113533-A1 EPOXIDE-BASED FIXING MORTAR HAVING SILANE ADDITIONS FISCHERWERKE GMBH & CO. KG (DE) 2011-09-22 WO disclosed
EP-0991688-B1 TWO-COMPONENT COATING AGENT ON AN EPOXY RESIN BASE FOR CEMENT-BOUND BACKGROUNDS DEGUSSA CONSTRUCTION CHEM GMBH (CH) 2005-10-12 EP disclosed
EP-0972192-B1 METHOD FOR MEASURING STRESS LEVELS IN POLYMERIC COMPOSITIONS MINNESOTA MINING & MFG (US) 2003-03-19 EP disclosed
EP-0991688-A1 TWO-COMPONENT COATING AGENT ON AN EPOXY RESIN BASE FOR CEMENT-BOUND BACKGROUNDS Conica Technik AG (CH) 2000-04-12 EP disclosed
WO-1998058981-A1 TWO-COMPONENT COATING AGENT ON AN EPOXY RESIN BASE FOR CEMENT-BOUND BACKGROUNDS CONICA TECHNIK AG (CH) 1998-12-30 WO disclosed