SCHEMBL237936

SCHEMBL237936

CCCCOCN(COCCCC)c1nc(N(COCCCC)COCCCC)nc(N(COCCCC)COCCCC)n1

nearest known ligand 0.38

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.38
SMN1; SMN2 Q16637 3/20 0.34
MAPT P10636 2/20 0.34
TDP1 Q9NUW8 2/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
CYP3A4 P08684 1/20 0.33
CRHR1 P34998 2/20 0.33
HPGD P15428 2/20 0.32
ADRB2 P07550 1/20 0.32
ADRB1 P08588 1/20 0.32
ADRB3 P13945 1/20 0.32
SLC29A1 Q99808 2/20 0.31
HTT P42858 2/20 0.30
THRB P10828 1/20 0.30
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14081584 0.94 TSHR (0.41) TSHRSMN1; SMN2MAPTTDP1MEN1
SCHEMBL11857194 0.94 TSHR (0.34) TSHRSMN1; SMN2MAPTTDP1MEN1
SCHEMBL15437935 0.94 MAPT (0.38) TSHRSMN1; SMN2MAPTTDP1MEN1
SCHEMBL12205533 0.92 TSHR (0.40) TSHRSMN1; SMN2MAPTTDP1MEN1
SCHEMBL15438033 0.92 HTT (0.41) TSHRSMN1; SMN2MAPTTDP1MEN1
SCHEMBL10628034 0.91 TSHR (0.41) TSHRSMN1; SMN2MAPTTDP1MEN1
SCHEMBL11126960 0.91 MAPT (0.39) TSHRSMN1; SMN2MAPTMEN1KMT2A
SCHEMBL11181529 0.91 TSHR (0.41) TSHRSMN1; SMN2MAPTTDP1MEN1
SCHEMBL14817361 0.91 TSHR (0.32) TSHRSMN1; SMN2MAPTTDP1MEN1
SCHEMBL4758768 0.87 LMNA (0.38) TSHRSMN1; SMN2MAPTMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 386 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6686120-B2 THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-03 US claimed
US-20030134222-A1 Photoresist composition and method of forming pattern using the same SAMSUNG ELECTRONICS CO., LTD. 2003-07-17 US claimed
US-4959400-A HEXA-ALKYL ETHERS OF HEXAMETHYLOLMELAMINE REACTED WITH PHENOLIC COMPOUNDS THE DOW CHEMICAL COMPANY (US) 1990-09-25 US claimed
EP-0155469-B1 EPOXY RESIN COMPOSITION AND A PROCESS FOR PREPARING LAMINATES THEREFROM THE DOW CHEMICAL COMPANY (US) 1988-07-20 EP claimed
US-4661568-A HARDENER WHICH IS THE REACTION PRODUCT OF A HEXAKIS (ALKOXYMETHYL)-MELAMINE AND A POLYHYDRIC PHENOL THE DOW CHEMICAL COMPANY (US) 1987-04-28 US claimed
EP-0169865-A1 EPOXY RESIN COMPOSITION AND PROCESS FOR PREPARING LAMINATES THEREFROM THE DOW CHEMICAL COMPANY (US) 1986-02-05 EP claimed
EP-0155469-A1 Epoxy resin composition and a process for preparing laminates therefrom THE DOW CHEMICAL COMPANY (US) 1985-09-25 EP claimed
US-4536420-A COATING WITH CARBOXYLIC ACID FUNCTIONAL POLYMER AND HYDROXYLATED SILICA, AND CURING; HEAT EXCHANGERS; EVAPORATORS; DRAINAGE GENERAL ELECTRIC COMPANY (US) 1985-08-20 US claimed
WO-1985003515-A1 EPOXY RESIN COMPOSITION AND PROCESS FOR PREPARING LAMINATES THEREFROM THE DOW CHEMICAL COMPANY (US) 1985-08-15 WO claimed
US-3945961-A Novel cross-linking agents and their use in electrophoretic coating composition AMERICAN CYANAMID COMPANY (US) 1976-03-23 US claimed
EP-4685840-A1 RELEASE AGENT COMPOSITION FOR PHOTOIRRADIATION RELEASE, LAYERED PRODUCT, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2026-01-28 EP disclosed
EP-4678708-A1 ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2026-01-14 EP disclosed
EP-4678709-A1 ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2026-01-14 EP disclosed
EP-4653507-A1 ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2025-11-26 EP disclosed
EP-4653508-A1 ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2025-11-26 EP disclosed
US-4092150-A Herbicidal 5-pyrimidinecarbonitriles FMC CORPORATION (US) 1978-05-30 US disclosed
US-4028300-A ACRYLIC COPOLYMERS, ETHERATED METHYLOLMELAMINE, AND PARTIAL HYDROLYZATES OF TETRAALKOXYSILANE AND AN ORGANIC SILICON COMPOUND SUMITOMO CHEMICAL COMPANY, LIMITED (JA) 1977-06-07 US disclosed
US-3960688-A AMINOPLAST CROSSLINKING AGENT, POLYMER, AROMATIC SULFONIC ACID CATALYST AMERICAN CYANAMID COMPANY (US) 1976-06-01 US disclosed
US-3945961-A Novel cross-linking agents and their use in electrophoretic coating composition AMERICAN CYANAMID COMPANY (US) 1976-03-23 US disclosed
US-3935330-A Two-step coating process UNION CARBIDE CORPORATION (US) 1976-01-27 US disclosed