SCHEMBL238037

SCHEMBL238037

B.O[Si](O)(O)O.[P]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL33512 0.91
SCHEMBL27667849 0.91
SCHEMBL976742 0.83
SCHEMBL11497420 0.83
Water SCHEMBL28936268 0.83
SCHEMBL2471032 0.83
SCHEMBL16796527 0.83
SCHEMBL3177770 0.83
SCHEMBL15416433 0.83
SCHEMBL11059242 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 7271 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12610794-B2 Semiconductor device and method having deep trench isolation SK KEYFOUNDRY INC. (KR) 2026-04-21 US claimed
US-12588351-B2 Electronic device and method for manufacturing electronic device SONY SEMICONDUCTOR SOLUTIONS CORPORATION (JP) 2026-03-24 US claimed
US-12170310-B2 Integrated circuits including composite dielectric layer TEXAS INSTRUMENTS INCORPORATED (US) 2024-12-17 US claimed
US-20240112948-A1 SEMICONDUCTOR DEVICE AND METHOD HAVING DEEP TRENCH ISOLATION KEY FOUNDRY CO., LTD. (KR) 2024-04-04 US claimed
US-20240032316-A1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SONY SEMICONDUCTOR SOLUTIONS CORPORATION (JP) 2024-01-25 US claimed
EP-2903028-B1 TRENCH DMOS DEVICE AND MANUFACTURING METHOD THEREOF CSMC TECHNOLOGIES FAB2 CO LTD (CN) 2021-02-03 EP claimed
CN-112117330-A Device structure for improving voltage resistance of deep-groove super-junction MOSFET and process method thereof 南京华瑞微集成电路有限公司 2020-12-22 CN claimed
US-10868039-B2 Manufacturing method of a semiconductor device SK Hynix Inc. (KR) 2020-12-15 US claimed
US-20200168629-A1 MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE SK Hynix Inc. (KR) 2020-05-28 US claimed
CN-110473919-A Semiconductor structure, high electron mobility transistor and semiconductor structure manufacturing method VANGUARD INT SEMICONDUCT CORP 2019-11-19 CN claimed
US-5240873-A Method of making charge transfer device INTELLECTUAL VENTURES II LLC 1993-08-31 US claimed
US-5210054-A Method for forming a contact plug SHARP KABUSHIKI KAISHA (JP) 1993-05-11 US claimed
EP-0523984-A1 Solid state image pick-up element SHARP KABUSHIKI KAISHA (JP) 1993-01-20 EP claimed
US-5166101-A Method for forming a boron phosphorus silicate glass composite layer on a semiconductor wafer APPLIED MATERIALS, INC. (US) 1992-11-24 US claimed
EP-0421203-A1 An integrated circuit structure with a boron phosphorus silicate glass composite layer on semiconductor wafer and improved method for forming same APPLIED MATERIALS, INC. (US) 1991-04-10 EP claimed
US-4984056-A Semiconductor integrated circuit device MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1991-01-08 US claimed
US-4980311-A Method of fabricating a semiconductor device SEIKO EPSON CORPORATION (JP) 1990-12-25 US claimed
US-4774561-A Semiconductor device MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 1988-09-27 US claimed
US-4603472-A Method of making MOS FETs using silicate glass layer as gate edge masking for ion implantation SIEMENS AKTIENGESELLSCHAFT (DE) 1986-08-05 US claimed
US-4410375-A Method for fabricating a semiconductor device TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1983-10-18 US claimed