⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28345527 | 0.82 | — | — | |
| SCHEMBL758253 | 0.82 | — | — | |
| SCHEMBL2436759 | 0.77 | — | — | |
| SCHEMBL426120 | 0.71 | — | — | |
| SCHEMBL28081731 | 0.71 | CA12 (0.42) | — | |
| SCHEMBL6232845 | 0.71 | — | — | |
| SCHEMBL3801581 | 0.70 | CA12 (0.32) | — | |
| SCHEMBL4351575 | 0.70 | ALDH1A1 (0.30) | — | |
| SCHEMBL530339 | 0.70 | — | — | |
| Potassium Ion SCHEMBL8214633 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024224871-A1 | CONDUCTIVE RESIN COMPOSITION | サカタインクス株式会社 | 2024-10-31 | — | — | WO | disclosed |
| CN-107868646-B | Conductive adhesive and conductive material | 日亚化学工业株式会社 | 2022-03-01 | — | — | CN | disclosed |
| US-9745406-B2 | Curable composition | CEMEDINE CO., LTD. (JP) | 2017-08-29 | — | — | US | disclosed |
| CN-106380894-A | Nonmetal powdery auxiliary agent | 廖煜明 | 2017-02-08 | — | — | CN | disclosed |
| EP-2412756-B1 | CURABLE COMPOSITION | CEMEDINE CO LTD (JP) | 2016-12-21 | — | — | EP | disclosed |
| US-8519049-B2 | Curable composition | CEMEDINE CO., LTD. (JP) | 2013-08-27 | — | — | US | disclosed |
| US-20120316253-A1 | CURABLE COMPOSITION | SAITO ATSUSHI (JP) | 2012-12-13 | — | — | US | disclosed |
| US-8217130-B2 | Curable composition and method for producing the same | CEMEDINE CO., LTD. (JP) | 2012-07-10 | — | — | US | disclosed |
| EP-2093252-B1 | Curing composition and method for producing curing composition | CEMEDINE CO LTD (JP) | 2012-05-16 | — | — | EP | disclosed |
| EP-2412756-A1 | CURABLE COMPOSITION | CEMEDINE CO., LTD. (JP) | 2012-02-01 | — | — | EP | disclosed |
| US-20120004371-A1 | CURABLE COMPOSITION | CEMEDINE CO., LTD. (JP) | 2012-01-05 | — | — | US | disclosed |
| US-20100267898-A1 | CURABLE COMPOSITION AND METHOD FOR PRODUCING THE SAME | CEMEDINE CO., LTD. | 2010-10-21 | — | — | US | disclosed |
| EP-1650257-B1 | CURING COMPOSITION AND METHOD FOR PRODUCING CURING COMPOSITION | CEMEDINE CO LTD (JP) | 2010-09-08 | — | — | EP | disclosed |
| US-7781559-B2 | Curable composition and method for producing the same | CEMEDINE CO., LTD. (JP) | 2010-08-24 | — | — | US | disclosed |
| EP-2093252-A1 | Curing composition and method for producing curing composition | CEMEDINE CO., LTD. (JP) | 2009-08-26 | — | — | EP | disclosed |
| US-20090118401-A1 | Curable Composition | CEMEDINE CO., LTD. (JP) | 2009-05-07 | — | — | US | disclosed |
| US-20060293456-A1 | Curable composition and method for producing the same | CEMEDINE CO., LTD. (JP) | 2006-12-28 | — | — | US | disclosed |
| EP-1650257-A1 | CURING COMPOSITION AND METHOD FOR PRODUCING CURING COMPOSITION | CEMEDINE CO., LTD. (JP) | 2006-04-26 | — | — | EP | disclosed |
| US-5068304-A | Hydrolyzable silyl group containing polyether compound as a curable component joined by urethane groups capable of forming a rubber like substance | ASAHI GLASS COMPANY, LTD. (JP) | 1991-11-26 | — | — | US | disclosed |
| EP-0372561-A2 | Moisture-curable resin composition | ASAHI GLASS COMPANY LTD. (JP) | 1990-06-13 | — | — | EP | disclosed |