SCHEMBL23854476

SCHEMBL23854476

O=[C]c1ccc2ccccc2c1N=O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.41
HSD17B10 Q99714 4/20 0.41
TDP1 Q9NUW8 4/20 0.41
CYP2A6 P11509 1/20 0.41
TSHR P16473 1/20 0.41
CA1 P00915 2/20 0.39
CA2 P00918 2/20 0.39
HSP90AA1 P07900 2/20 0.38
HPRT1 P00492 1/20 0.38
PAX8 Q06710 1/20 0.36
HPGD P15428 3/20 0.36
CYP1A2 P05177 2/20 0.36
ABCB11 O95342 1/20 0.36
NR3C1 P04150 1/20 0.36
CYP3A4 P08684 1/20 0.36
ADRA2A P08913 1/20 0.36
ADORA3 P0DMS8 1/20 0.36
ALOX15 P16050 1/20 0.36
ADRA2C P18825 1/20 0.36
MAOA P21397 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1275863 0.78 HSP90AA1 (0.47) ALDH1A1HSD17B10TDP1CYP2A6TSHR
SCHEMBL10427612 0.75 ALDH1A1 (0.48) ALDH1A1HSD17B10TDP1CYP2A6TSHR
SCHEMBL3441131 0.74 ALDH1A1 (0.46) ALDH1A1HSD17B10TDP1CYP2A6TSHR
SCHEMBL2231383 0.72 PTPN22 (0.54) ALDH1A1HSD17B10TDP1CYP2A6TSHR
SCHEMBL14118304 0.72 TSHR (0.54) ALDH1A1HSD17B10TDP1CYP2A6TSHR
SCHEMBL1920365 0.72 HSD17B10 (0.48) ALDH1A1HSD17B10TDP1CYP2A6TSHR
SCHEMBL11028783 0.72 ALDH1A1 (0.46) ALDH1A1HSD17B10TDP1CYP2A6TSHR
SCHEMBL9669191 0.72 CYP2A6 (0.54) ALDH1A1HSD17B10TDP1CYP2A6TSHR
SCHEMBL103998 0.72 THRB (0.59) ALDH1A1HSD17B10TDP1HSP90AA1HPGD
SCHEMBL9669197 0.72 TSHR (0.54) ALDH1A1HSD17B10TDP1CYP2A6TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed