SCHEMBL23854483

SCHEMBL23854483

COCCN(Cc1ccccc1)c1ccc(F)c([Ti](c2c(F)ccc(N(CCOC)Cc3ccccc3)c2F)(C2C=CC=C2)C2C=CC=C2)c1F

nearest known ligand 0.33

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
CRHR1 P34998 1/20 0.33
LMNA P02545 1/20 0.30
IDO1 P14902 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23854494 0.84 CYP2C19 (0.40) SMN1; SMN2
SCHEMBL29480041 0.79 KMT2A (0.37) MEN1KMT2A
SCHEMBL23854490 0.79 CETP (0.34)
SCHEMBL23854489 0.77 KDM4E (0.31)
SCHEMBL29479949 0.76 POLB (0.42) MEN1KMT2ASMN1; SMN2LMNA
SCHEMBL29480010 0.73 TSHR (0.40) MEN1KMT2A
SCHEMBL29480036 0.72 RAB9A (0.39) MEN1KMT2ASMN1; SMN2LMNA
SCHEMBL20291447 0.71 RIPK1 (0.40) LMNA
SCHEMBL29480057 0.71 MEN1 (0.38) MEN1KMT2ASMN1; SMN2LMNA
SCHEMBL23854460 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed