SCHEMBL2386946

SCHEMBL2386946

Cc1ccc(O)c(Cc2cc(Cc3cc(C)c(O)c(Cc4cc(C)ccc4O)c3)cc(C)c2O)c1

nearest known ligand 0.69

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AMY1A P0DUB6 1/20 0.69
SHBG P04278 1/20 0.56
ESR1 P03372 1/20 0.47
ESR2 Q92731 1/20 0.47
TP53 P04637 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
HIF1A Q16665 4/20 0.42
CYP2C9 P11712 3/20 0.42
CYP2C19 P33261 3/20 0.42
HMGB1 P09429 1/20 0.41
CXCL12 P48061 1/20 0.41
TRPA1 O75762 1/20 0.39
SMN1; SMN2 Q16637 3/20 0.39
ALOX15 P16050 3/20 0.39
HTT P42858 2/20 0.39
HSPA5 P11021 2/20 0.39
MAPT P10636 2/20 0.39
LMNA P02545 2/20 0.39
HPGD P15428 2/20 0.39
MEN1 O00255 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30320337 1.00 AMY1A (0.69) AMY1ASHBGESR1ESR2TP53
SCHEMBL7546172 0.97 AMY1A (0.75) AMY1ASHBGESR1ESR2TP53
SCHEMBL24541912 0.94 AMY1A (0.61) AMY1ASHBGESR1ESR2TP53
SCHEMBL21096825 0.94 AMY1A (0.66) AMY1ASHBGESR1ESR2TP53
SCHEMBL4056593 0.94 AMY1A (0.75) AMY1ASHBGESR1ESR2TP53
SCHEMBL23864821 0.93 AMY1A (0.64) AMY1ASHBGESR1ESR2TP53
SCHEMBL22787089 0.91 AMY1A (0.82) AMY1ASHBGESR1ESR2TP53
SCHEMBL30374503 0.91 AMY1A (0.82) AMY1ASHBGESR1ESR2TP53
SCHEMBL27481342 0.89 AMY1A (0.63) AMY1ASHBGESR1ESR2TP53
SCHEMBL5364380 0.88 AMY1A (0.65) AMY1ASHBGESR1ESR2TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 128 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2203783-A2 THICK FILM RESISTS AZ Electronic Materials USA Corp. (US) 2010-07-07 EP claimed
WO-2009040661-A2 THICK FILM RESISTS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2009-04-02 WO claimed
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 US claimed
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
EP-1614005-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-01-11 EP claimed
US-6905809-B2 Photoresist compositions CLARIANT FINANCE (BVI) LIMITED (VG) 2005-06-14 US claimed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
WO-2004088424-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
US-20040197696-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
CN-118295211-A Positive photosensitive resin composition, method for forming pattern by photoresist, and printed circuit board 深圳市容大感光科技股份有限公司 2024-07-05 CN disclosed
CN-117850163-A Positive photosensitive resin composition, method for forming pattern by photoresist, and printed circuit board 深圳市容大感光科技股份有限公司 2024-04-09 CN disclosed
CN-111205648-B Curable composition, cured product, microlens, and optical element 东京应化工业株式会社 2023-12-08 CN disclosed
US-6207788-B1 FROM 2,6-DIMETHYLOL-4-METHYLPHENOL AND BIS(2,5-DIMETHYL-4-HYDROXYPHENYL)METHANE TOKYO OHKA KOGYA CO., LTD. (JP) 2001-03-27 US disclosed
US-6187500-B1 PHOTORESIST MATERIAL COMPRISING BLEND OF ALKALI-SOLUBLE NOVOLAK RESIN AND A 1,2-NAPHTHOQUINONEDIAZIDE-5-SULFONIC ESTER; FINE RESOLUTION TOKYO OHKA KOGYO CO., LTD. (JP) 2001-02-13 US disclosed
US-6177226-B1 PROVIDES A CONTACT HOLE PATTERN IMAGE HAVING LESS DIMPLES AND BEING IN EXACT ACCORDANCE WITH A MASK PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2001-01-23 US disclosed
EP-0902326-A2 Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin TOKYO OHKA KOGYO CO., LTD. (JP) 1999-03-17 EP disclosed
US-5866724-A Positive resist composition and photosensitizers SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-02-02 US disclosed