SCHEMBL23909532

SCHEMBL23909532

NC(=O)c1ccc2cc([N+](=O)[O-])ccc2c1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.67
GAA P10253 2/20 0.61
LMNA P02545 1/20 0.61
CYP3A4 P08684 1/20 0.56
SMN1; SMN2 Q16637 1/20 0.56
SIRT2 Q8IXJ6 2/20 0.56
LCK P06239 1/20 0.55
POLB P06746 2/20 0.54
KMT2A Q03164 3/20 0.51
PARP1 P09874 1/20 0.51
CES1 P23141 1/20 0.50
MEN1 O00255 2/20 0.49
MAPT P10636 2/20 0.49
CA1 P00915 2/20 0.48
CA2 P00918 2/20 0.48
TDP1 Q9NUW8 1/20 0.48
CHEK2 O96017 1/20 0.48
ALDH1A1 P00352 1/20 0.47
MAPK1 P28482 1/20 0.47
KDM4E B2RXH2 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909526 0.95 TSHR (0.65) TSHRGAALMNACYP3A4SMN1; SMN2
SCHEMBL27553609 0.84 TDP1 (0.66) TSHRLMNACYP3A4KMT2ACES1
Hydrochloric Acid SCHEMBL11775187 0.82 TDP1 (0.63) TSHRLMNACYP3A4KMT2ACES1
SCHEMBL11775169 0.82 ALDH1A1 (0.67) TSHRGAAKMT2ACES1MEN1
Hydrochloric Acid SCHEMBL11775184 0.82 TDP1 (0.63) TSHRLMNACYP3A4KMT2ACES1
Terephthalamide SCHEMBL27950892 0.81 TSHR (1.00) TSHRGAALMNACYP3A4SMN1; SMN2
SCHEMBL260727 0.81 TSHR (1.00) TSHRGAALMNACYP3A4SMN1; SMN2
SCHEMBL2363489 0.80 LCK (0.78) TSHRSMN1; SMN2LCKKMT2APARP1
SCHEMBL28122579 0.80 TSHR (0.59) TSHRGAALMNACYP3A4SMN1; SMN2
SCHEMBL17288730 0.80 MEN1 (0.49) TSHRGAALMNASMN1; SMN2KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed