SCHEMBL23909545

SCHEMBL23909545

COC(=O)c1ccc2ccc(C(N)=O)cc2c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LCK P06239 2/20 0.56
PLAU P00749 3/20 0.56
PLAT P00750 1/20 0.56
PTPN11 Q06124 1/20 0.53
CA12 O43570 2/20 0.52
CA1 P00915 2/20 0.52
CA2 P00918 2/20 0.52
CA7 P43166 2/20 0.52
CA9 Q16790 2/20 0.52
CA14 Q9ULX7 2/20 0.52
XDH P47989 1/20 0.52
MAPT P10636 4/20 0.51
KDM4E B2RXH2 2/20 0.51
ALDH1A1 P00352 2/20 0.51
HPGD P15428 2/20 0.51
HSD17B10 Q99714 2/20 0.51
GLA P06280 1/20 0.51
GAA P10253 1/20 0.51
CASP1 P29466 1/20 0.51
CASP7 P55210 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30362240 0.94 PLAU (0.60) LCKPLAUPLATPTPN11CA12
SCHEMBL5560862 0.94 PLAU (0.60) LCKPLAUPLATPTPN11CA12
SCHEMBL709231 0.90 LCK (0.62) LCKPTPN11CA12CA1CA2
SCHEMBL15775051 0.86 LCK (0.51) LCKPLAUPLATPTPN11CA12
SCHEMBL9979782 0.84 PTPN11 (0.64) LCKPLAUPTPN11CA12CA1
SCHEMBL69025 0.84 PTPN11 (0.68) LCKPLAUPTPN11CA12CA1
SCHEMBL29365729 0.84 PTPN11 (0.68) LCKPLAUPTPN11CA12CA1
SCHEMBL30935786 0.84 LCK (0.75) LCKPLAUMAPTKDM4EALDH1A1
SCHEMBL4405181 0.84 LCK (0.75) LCKPLAUMAPTKDM4EALDH1A1
SCHEMBL6416051 0.84 PLAU (0.56) LCKPLAUPTPN11CA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed