SCHEMBL30935786

SCHEMBL30935786

NC(=O)c1ccc2ccc(C(N)=O)cc2c1

nearest known ligand 0.75

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LCK P06239 1/20 0.75
PLAU P00749 5/20 0.53
CES2 O00748 1/20 0.50
CES1 P23141 1/20 0.50
ALDH1A1 P00352 2/20 0.48
HSD17B10 Q99714 2/20 0.48
KDM4E B2RXH2 1/20 0.48
BRD4 O60885 1/20 0.48
BRPF1 P55201 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.48
CYP2A6 P11509 1/20 0.48
PARP1 P09874 6/20 0.48
TSHR P16473 2/20 0.47
F2 P00734 2/20 0.46
PLG P00747 2/20 0.46
KLKB1 P03952 2/20 0.46
PRSS1 P07477 2/20 0.46
KLK1 P06870 1/20 0.46
KMT2A Q03164 1/20 0.46
PARP15 Q460N3 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4405181 1.00 LCK (0.75) LCKPLAUCES2CES1ALDH1A1
SCHEMBL2363489 0.92 LCK (0.78) LCKPLAUCES2CES1ALDH1A1
SCHEMBL546633 0.88 CES2 (0.68) LCKPLAUCES2CES1ALDH1A1
SCHEMBL26903783 0.88 CES2 (0.68) LCKPLAUCES2CES1ALDH1A1
SCHEMBL29462782 0.88 CES2 (0.68) LCKPLAUCES2CES1ALDH1A1
SCHEMBL15774265 0.87 LCK (0.60) LCKPLAUCES2CES1ALDH1A1
SCHEMBL27033525 0.87 LCK (0.60) LCKPLAUCES2CES1ALDH1A1
SCHEMBL7391467 0.87 CYP2A6 (0.69) LCKPLAUALDH1A1HSD17B10KDM4E
Hydrochloric Acid SCHEMBL8358165 0.86 CES2 (0.65) LCKPLAUCES2CES1ALDH1A1
Hydrochloric Acid SCHEMBL22558829 0.86 CES2 (0.65) LCKPLAUCES2CES1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113462278-B Varnish composition, method for producing polyimide resin, and additive 东京应化工业株式会社 2024-06-07 CN disclosed