SCHEMBL23909567

SCHEMBL23909567

O=C(NS(=O)(=O)c1ccc([N+](=O)[O-])cc1)c1ccc([N+](=O)[O-])cc1

nearest known ligand 0.85

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FLT1 P17948 5/20 0.85
FLT4 P35916 5/20 0.85
KDR P35968 5/20 0.85
CA2 P00918 4/20 0.66
MMP2 P08253 3/20 0.66
CA1 P00915 3/20 0.66
MMP1 P03956 1/20 0.66
MMP9 P14780 1/20 0.66
MMP8 P22894 1/20 0.66
MMP13 P45452 1/20 0.66
GAA P10253 6/20 0.62
CA12 O43570 3/20 0.58
CA9 Q16790 3/20 0.58
CA14 Q9ULX7 3/20 0.58
CA3 P07451 1/20 0.56
CA4 P22748 1/20 0.56
CA6 P23280 1/20 0.56
CA5A P35218 1/20 0.56
CA7 P43166 1/20 0.56
CA13 Q8N1Q1 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8654939 0.94 FLT1 (0.76) FLT1FLT4KDRCA2MMP2
SCHEMBL8627793 0.92 FLT1 (0.74) FLT1FLT4KDRCA2MMP2
SCHEMBL31061163 0.92 FLT1 (1.00) FLT1FLT4KDRCA2MMP2
SCHEMBL8661710 0.92 FLT1 (0.74) FLT1FLT4KDRCA2MMP2
SCHEMBL8769715 0.90 FLT1 (0.71) FLT1FLT4KDRCA2MMP2
SCHEMBL7776322 0.85 FLT1 (0.64) FLT1FLT4KDRCA2MMP2
SCHEMBL7776164 0.85 FLT1 (0.64) FLT1FLT4KDRCA2MMP2
SCHEMBL9468106 0.85 FLT1 (0.64) FLT1FLT4KDRCA2CA1
SCHEMBL7774805 0.84 FLT1 (0.63) FLT1FLT4KDRCA2MMP2
SCHEMBL8658616 0.83 KDR (0.62) FLT1FLT4KDRCA2CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed