SCHEMBL23909593

SCHEMBL23909593

N#Cc1cccc2ccc(C(=O)Cl)cc12

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 3/20 0.45
CA2 P00918 3/20 0.45
HTT P42858 1/20 0.39
CES2 O00748 1/20 0.38
CES1 P23141 1/20 0.38
ALDH1A1 P00352 3/20 0.37
KDM4E B2RXH2 1/20 0.37
PLA2G2D Q9UNK4 1/20 0.37
CASP3 P42574 1/20 0.37
SENP8 Q96LD8 1/20 0.37
SENP7 Q9BQF6 1/20 0.37
SENP6 Q9GZR1 1/20 0.37
PLAU P00749 2/20 0.36
SLC9A1 P19634 1/20 0.36
TSHR P16473 1/20 0.36
MAPT P10636 1/20 0.36
HPGD P15428 1/20 0.36
F2 P00734 1/20 0.36
PLG P00747 1/20 0.36
PLAT P00750 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4847989 0.87 PTPN1 (0.42) CA1CA2HTTCES2CES1
SCHEMBL23909588 0.84 CA1 (0.45) CA1CA2HTTPLAUSLC9A1
SCHEMBL7348003 0.80 NQO2 (0.46) CA1CA2HTTALDH1A1KDM4E
SCHEMBL2154707 0.76 PLA2G2D (0.51) CES2CES1ALDH1A1KDM4EPLA2G2D
SCHEMBL11148876 0.75 ALDH1A1 (0.55) HTTCES2CES1ALDH1A1KDM4E
Bicarbonate SCHEMBL11600417 0.75 CA1 (0.51) CA1CA2HTTALDH1A1KDM4E
SCHEMBL112028 0.74 ESR2 (0.57) CA1CA2HTTMCL1
SCHEMBL30345060 0.74 ESR2 (0.57) CA1CA2HTTMCL1
SCHEMBL13082394 0.73 ALDH1A1 (0.43) CA1CA2ALDH1A1KDM4EMAPT
SCHEMBL30950126 0.73 ALDH1A1 (0.43) CA1CA2ALDH1A1KDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed