Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 7/20 | 0.56 |
| ▸ | CA1 | P00915 | 6/20 | 0.56 |
| ▸ | CA9 | Q16790 | 4/20 | 0.56 |
| ▸ | ATIC | P31939 | 1/20 | 0.48 |
| ▸ | PTGES2 | Q9H7Z7 | 3/20 | 0.44 |
| ▸ | CDK2 | P24941 | 1/20 | 0.42 |
| ▸ | CA12 | O43570 | 1/20 | 0.41 |
| ▸ | SLC6A4 | P31645 | 5/20 | 0.40 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.39 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
| ▸ | CA13 | Q8N1Q1 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23909576 | 0.87 | CA1 (0.56) | CA2CA1CA9ATICPTGES2 | |
| SCHEMBL12212871 | 0.85 | CA1 (0.51) | CA2CA1CA9ATICSLC6A4 | |
| SCHEMBL23909530 | 0.84 | CA1 (0.54) | CA2CA1CA9SLC6A4SLC6A2 | |
| SCHEMBL1346003 | 0.76 | CA2 (0.63) | CA2CA1CA9ATICCDK2 | |
| SCHEMBL1805507 | 0.76 | CA2 (0.63) | CA2CA1CA9ATICCDK2 | |
| SCHEMBL30440356 | 0.76 | CA2 (0.63) | CA2CA1CA9ATICCDK2 | |
| SCHEMBL1805508 | 0.75 | CA2 (0.61) | CA2CA1CA9ATICCDK2 | |
| SCHEMBL1807861 | 0.75 | CA2 (0.61) | CA2CA1CA9ATICCDK2 | |
| SCHEMBL12212866 | 0.74 | CA1 (0.50) | CA2CA1CA9ATICCDK2 | |
| SCHEMBL5092282 | 0.74 | CA1 (0.53) | CA2CA1SLC6A4SLC6A2SLC6A3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113527680-B | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2023-04-28 | — | — | CN | disclosed |
| EP-3896521-B1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2022-12-14 | — | — | EP | disclosed |
| US-11333975-B2 | Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-05-17 | — | — | US | disclosed |
| CN-113527680-A | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| EP-3896521-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-20210317268-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |