SCHEMBL23909576

SCHEMBL23909576

N#Cc1ccc2cccc(S(N)(=O)=O)c2c1

nearest known ligand 0.56

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CA1 P00915 8/20 0.56
CA2 P00918 8/20 0.56
CA9 Q16790 5/20 0.56
PTGES2 Q9H7Z7 3/20 0.44
CA12 O43570 2/20 0.42
CDK2 P24941 1/20 0.42
KDM4E B2RXH2 1/20 0.40
ALDH1A1 P00352 1/20 0.40
LMNA P02545 1/20 0.40
MAPT P10636 1/20 0.40
HPGD P15428 1/20 0.40
HTT P42858 1/20 0.40
ATIC P31939 1/20 0.39
MAPK1 P28482 1/20 0.39
CA13 Q8N1Q1 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909598 0.87 CA2 (0.56) CA1CA2CA9PTGES2CA12
SCHEMBL23909607 0.84 CA1 (0.50) CA1CA2CA9KDM4EALDH1A1
SCHEMBL12212866 0.84 CA1 (0.50) CA1CA2CA9CDK2KDM4E
SCHEMBL1806696 0.76 CA2 (0.63) CA1CA2CA9CA12CDK2
SCHEMBL1806509 0.76 CA1 (0.63) CA1CA2CA9CA12CDK2
SCHEMBL1806700 0.75 CA1 (0.61) CA1CA2CA9CA12CDK2
SCHEMBL1806513 0.75 CA2 (0.61) CA1CA2CA9PTGES2CA12
SCHEMBL4084268 0.74 CA1 (0.53) CA1CA2CDK2KDM4EALDH1A1
SCHEMBL4332304 0.74 CTDSP1 (0.53) CA1CA2CA9CA12KDM4E
SCHEMBL7720420 0.73 CA1 (0.53) CA1CA2KDM4EALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed